Abstract:With the continuous reduction in size and increase in density of semiconductor devices, there is a growing demand for contact solutions that enable high-speed testing in automotive, 5G, and artificial intelligence-based devices. Although existing solutions, such as spring pins and rubber sockets, have been effective in various applications, there is still a need for new solutions that accommodate fine-pitch, high-speed, and high-density requirements. This study proposes a novel three-dimensional microelectrome… Show more
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