Abstract:Although printed electronics technology has been recently employed in the production of various devices, its use for the fabrication of electronic devices with air-gap structures remains challenging. This paper presents a productive roll-to-roll printed electronics method for the fabrication of capacitive touch sensors with air-gap structures. Each layer of the sensor was fabricated by printing or coating. The bottom electrode, and the dielectric and sacrificial layers were roll-to-roll slot-die coated on a fl… Show more
“…It can be a simple parallel plate capacitor or integrated into an FET device as the gate capacitor. [ 47,65–68 ] The pressure sensitivity of a capacitive pressure sensor can be defined as: where C and C 0 are the capacitances with and without applied pressure, Δ C = C − C 0 , and p is the applied pressure. It is usually not constant and tends to decrease with large increases in pressure.…”
The marriage of organic thin‐film transistors (OTFTs) and flexible mechanical sensors has enabled previously restricted applications to become a reality. Counterintuitively, the addition of an OTFT at each sensing element can reduce the overall complexity so that large‐area, low‐noise sensors can be fabricated. The best‐performing instance of this is the active matrix, used in display applications for many of the same reasons, and nearly any type of flexible mechanical sensor can be incorporated into these structures. In this Progress Report, some of the flexible sensor devices that have taken advantage of these mechanical properties are highlighted, examining the advantages that OTFTs offer in the hybrid integration of local amplification and switching. In particular, the current research on resistive pressure sensors, capacitive pressure sensors, resistive or piezoresistive strain sensors, and piezoelectric sensors is identified and enumerated.
“…It can be a simple parallel plate capacitor or integrated into an FET device as the gate capacitor. [ 47,65–68 ] The pressure sensitivity of a capacitive pressure sensor can be defined as: where C and C 0 are the capacitances with and without applied pressure, Δ C = C − C 0 , and p is the applied pressure. It is usually not constant and tends to decrease with large increases in pressure.…”
The marriage of organic thin‐film transistors (OTFTs) and flexible mechanical sensors has enabled previously restricted applications to become a reality. Counterintuitively, the addition of an OTFT at each sensing element can reduce the overall complexity so that large‐area, low‐noise sensors can be fabricated. The best‐performing instance of this is the active matrix, used in display applications for many of the same reasons, and nearly any type of flexible mechanical sensor can be incorporated into these structures. In this Progress Report, some of the flexible sensor devices that have taken advantage of these mechanical properties are highlighted, examining the advantages that OTFTs offer in the hybrid integration of local amplification and switching. In particular, the current research on resistive pressure sensors, capacitive pressure sensors, resistive or piezoresistive strain sensors, and piezoelectric sensors is identified and enumerated.
“…Since the electrical performance of our acceleration sensors is affected greatly by the air gap thickness, reducing the size of sensor samples is desired highly. In fact, the sensor samples made in this study are about 75% of our previous bridge type air gap-based touch sensors [55].…”
Section: Electrical Characteristics Of the Sensor Samplesmentioning
confidence: 99%
“…Some examples are motion sensors [52], touch sensors [53] and switching devices. [54] An air gap-based bridge type touch sensor was fabricated and reported by the authors [55], but studies on the fabrication of air gap acceleration sensors have not been reported and fabrication of air gap-based electronic devices using the productive roll-to-roll process has not been conducted either. The roll-to-roll printing process is difficult to optimize compared to the sheet-to-sheet approach using ordinary printing processes including screen printing, inkjet printing, and spin coating.…”
This paper presents the fabrication by means of roll-to-roll slot-die coating and characterization of air gap-based cantilever type capacitive acceleration sensors. As the mass of the sensor moves in the opposite direction of the acceleration, a capacitance change occurs. The sensor is designed to have a six layers structure with an air gap. Fabrication of the air gap and cantilever was enabled by coating and removing water-soluble PVA. The bottom electrode, the dielectric layer, and the sacrificial layer were formed using the roll-to-roll slot-die coating technique. The spacer, the top electrode, and the structural layer were formed by spin coating. Several kinds of experiments were conducted for characterization of the fabricated sensor samples. Experimental results show that accelerations of up to 3.6 g can be sensed with an average sensitivity of 0.00856 %/g.
“…It is found from our previous reports that poly(vinyl alcohol) (PVA) is more suitable for the sacrificial layer than those three materials in Table 1. 43,45 Since PVA is the representative water-soluble material, 46 As for fabrication processes of air-gap-structured electronic devices, inkjet printing and screen printing have been often used in printed electronics, 42−44 but roll-to-roll processes are considered more productive. 47−49 Printing/coating and curing are executed continuously during the roll-to-roll process, as the flexible substrate moves from the unwinder to the rewinder (Figure 1a).…”
Section: ■ Introductionmentioning
confidence: 99%
“…This study aims at developing a roll-to-roll printed electronics technology for fabricating air-gap-based flexible sensors without relying on the MEMS process. The authors' previous work 45 presents bridge-structured touch sensors with an air-gap, but the sensitivity of 0.0026%/kPa needs a significant improvement. Herein, a new design with a smaller size and a cantilever structure is proposed.…”
It is common in the field of printed electronics that polydimethylsiloxane (PDMS) be used as a dielectric layer for capacitive sensors because of its high elasticity and restoration force. However, capacitive sensors with the PDMS dielectric layer have a lower sensitivity than those with an air-gap structure that has been fabricated by the conventional micro-electromechanical system (MEMS) process. This paper presents a productive method for fabricating air-gap structures for touch sensors by roll-to-roll slot-die coating. The air-gap is formed by coating and removing a sacrificial layer. Cantilever-structured capacitive touch sensors with an air-gap are fabricated as follows: First, the bottom electrode, the dielectric layer, and the poly(vinyl alcohol) (PVA) sacrificial layer are roll-to-roll slot-die-coated on a flexible substrate. In addition, the spacer layer is spin-coated. On the sacrificial and spacer layers, the top electrode and structural layer are formed by spin-coating. Then, the air-gap and cantilever structure are made by removing the sacrificial layer in water. The cantilever-structured sensor samples are examined in terms of sensitivity, hysteresis, and repeatability. In particular, the electrical performance of the samples is compared to those with the PDMS dielectric layer. Experimental results show that the cantilever-structured sensor samples have significantly higher sensitivity compared to those with the PDMS dielectric layer.
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