Fabrication and Characterization of Organic Solar Cells with Gold Nanoparticles in PEDOT:PSS Hole Transport Layer

Abstract

In this paper, organic solar cells(OSCs) based on bulk-heterojunction structures were fabricated by spin coating method using polymer P3HT and fullerene PCBM as a photoactive layer. The fabricated OSCs had a simple glass/ITO/ PEDOT:PSS/P3HT:PCBM/Al structures. The photoactive layer of mixed P3HT:PCBM was formed with 1:1 weight ratio. The hole transport layer(HTL) was used conducting polymer PEDOT:PSS concentration with gold nanoparticles. The annealing temperature and concentration of nanoparticles in HTL were verified to improve the OSC characterization. The percentage of gold nanoparticles in HTL were 0.5 wt% and 1.0 wt%, and the surface morphology, electrical properties and absorption intensities were investigated. The devices were 0.5 wt%, and the highest 3.1% of the powder conversion efficiency(PCE), 10.2 mA/cm 2 of the maximum short circuit current density(J SC), 0.535V of the open circuit voltage(V OC) and 55.8% of the fill factor(F.F) could be obtained when the nanoparticle concertration was 0.5 wt%. The annealing temperature of HTL was 110 o C, 130 o C, 150 o C in vacuum oven and measured the absorption intensities, surface morphology, crystallinity and electrical properties were investigated. The best property was obtained in HTL annealed at 130 o C for gold nanoparticles of 0.5 wt%, showing that J SC , V OC , F.F and PCE were about 12.0 mA/cm 2 , 0.525V, 64.2% and 4.0%, respectively.

Thermal Assisted UV-Ozone Treatment to Improve Reliability of Ag Nanoparticle Thin Films

“…Direct printing method without vacuum deposition process has attracted considerable attention as a new method for fabricating electronic devices such as electrical skin 1) , displays 2) and bendable solar cells. [3][4] The direct printing method enables shorter production runs, simpler and lower cost fabrication by exploiting flexible substrate based electronics. Also, thermal deformation problem caused by the high temperature of conventional process can be solved through low temperature process using the lower melting point 5) of metal nanoparticle ink.…”