For electrical discrimination of the two-dimensional random nanostructure in terms of nano-artifact metrics, we investigated the sensitivity to the nanostructure in a Si MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) with a micrometer channel length by both simulation and experiment. The device simulation showed that the drain current in the Si MOSFET was modulated by embedding a nano-convex in the channel, even with a channel length of 10 μm. The sensitivity to the nanostructure was increased by decreasing the channel length and by increasing the nano-convex height up to 50 nm. However, the fabricated Si MOSFET with a 50-nm-height nano-convex showed smaller nanostructure sensitivity than that expected in the simulation. A detailed analysis on the fabricated devices indicated that the degradation of the sensitivity was attributed to the fabrication process issues including unintentional reduction of the convex size and high source and drain resistance.