Fabrication & characterization of high aspect ratio fine pitch deep reactive ion etched through-wafer electroplated copper interconnects

Abstract

, for providing their full support. • To my childhood friends Waseem Ahmed, Manish Tiwari, Alok Yadav, Goverdhan Dobhal, my brother Sandeep Dixit and sister Shalini Dixit and many others for their friendly support and advice. Finally my special gratitude is towards my parents and family, for their love, encouragement and support throughout my research duration. Without my parents, I would not have learnt the meaning of working hard. By creating the opportunities for me to have a good education, they have provided me the best possible thing, I could have ever wished for. To them, I am eternally grateful. Special thanks and appreciation are to my girl friend Zhao Jin, for standing besides me during the tough time. Her encouragement and selfless support has motivated me to achieve success in completing this research work. I would also like to thank her parents Liu Huamin and Zhao Anmin for their continuous trust and support.

Micro electret power generator for ambient vibration energy harvesting

“…Based on a standard set of etching parameters with an etch rate of around 2.4µm/min in a STS-ICP etch system [187], as listed in Table 5.6, the corresponding ion density can be computed to be 150×10 10 cm -3 [188]. The substrate temperature is 283K.…”