Fabricating HARMS by using megasonic assisted electroforming

Liu, Gang; Huang, Xianghua; Xiong, Ying; Tian, Yangchao

doi:10.1007/s00542-007-0556-1

Cited by 21 publications

(2 citation statements)

References 8 publications

(5 reference statements)

Supporting

Mentioning

Contrasting

Order By: Relevance

“…For trenches, AS inside the via has no major influence, which follows from both theoretical considerations regarding AS in narrow closed channels with a reflective bottom and real-life experiments, e.g., [14].…”

Section: Discussionmentioning

confidence: 99%

Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming

et al. 2013

View full text Add to dashboard Cite

This paper considers the copper electrodeposition processes in microvias and investigates whether the quality of the electroplating process can be improved by acoustic streaming using megasonic transducers placed into a plating cell. The theoretical results show that acoustic streaming does not take place within the micro-via (either through or blind-via's) but it does help improve cupric ion transport in the area close to the mouth of a via. This replenishment of cupric ions at the mouth of micro-via leads to better quality filling of the micro-via through diffusion compared to basic conditions. Experiments showing the improved quality of the filling of vias are also presented.

show abstract

Section: Discussionmentioning

confidence: 99%

Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming

et al. 2013

View full text Add to dashboard Cite

show abstract

“…For further improvement, the ultrasonic agitation is used in the micro electroforming and is an effective way to improve the thickness uniformity [19,20]. But for longtime electroforming, the high temperature and pressure caused by ultrasonic cavitation may destroy the photoresist structures [21], which limits the application of ultrasonic electroforming to a certain extent. Because electric field distribution directly determines the thickness uniformity of micro electroforming, the methods of optimizing electric field distribution, such as auxiliary cathode [13,[22][23][24] and insulating shield [25] have been developed.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of metal microfluidic chip mold with coplanar auxiliary cathode in the electroforming process

Zhao

Wei

et al. 2018

J. Micromech. Microeng.

View full text Add to dashboard Cite

Thickness nonuniformity is one of the prominent problems in the electroforming process of the metal microfluidic chip mold, which decreases the dimensional accuracy of the mold, and has a direct influence on the usability of the microfluidic chip. A novel method of auxiliary cathode for improving the thickness uniformity of electroformed mold is presented in this paper. Compared with the traditional method of the auxiliary cathode, a coplanar auxiliary cathode similar to the local microstructure of mold is used to fabricate the electroformed mold, and the thickness uniformity of electroformed mold is improved obviously. In addition, in order to determine the dimensions and placement of the auxiliary cathode, the computer-aided analysis is performed to simulate electroforming process. The simulated results show that with the help of a specially designed auxiliary cathode, the thickness uniformity is improved by about 53.2% compared with the result without the auxiliary cathode. Finally, based on the simulation, a microfluidic chip mold is fabricated by micro electroforming with the coplanar auxiliary cathode. The result shows that the thickness uniformity of the mold is improved by about 49.1%, which is in good agreement with the simulation result.

show abstract