Fabricating chambers of inkjet printhead by bonding SU-8 nozzle plate with suitable crosslinked degree

Wang, Xing; Yang, Zheng; Qi, Liping; Yan, Shixia; Wang, Shangfei; Yi, Maocong; Shan, Xiao; Zhou, Jiangang; Zou, Helin

doi:10.1007/s00542-019-04316-3

Cited by 2 publications

(2 citation statements)

References 24 publications

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“…The process of fabricating chambers is becoming more important for the inkjet printhead. However, there are some problems with the majority of present fabrication methods, such as nozzle structural deformation, blocked chambers, and collapsed chambers [ 17 , 18 , 19 ]. As a semi-closed three-dimensional structure, the printhead chamber is one of the difficulties in the whole preparation process of an inkjet head.…”

Section: Introductionmentioning

confidence: 99%

“…Liou et al (2010) fabricated a monolithic thermal inkjet printhead based on MEMS fabrication processes including the sacrificial layer process, and the results showed that the major advantage of the inkjet chip assembly processes is improved throughput [ 22 ]. Wang et al (2019) fabricated chambers of inkjet printheads by thermal bonding an SU-8 nozzle plate with a suitable crosslinked degree; the results showed that the optimized bonding strength of 0.57 MPa and chamber deformation rate of 4.35% were obtained in the final inkjet printhead [ 17 ]. However, the sacrificial layer technique suffers from some problems, including a long fabrication process and complicated workmanship due to the difficult removal of the sacrificial layer caused by the semiclosed chamber structure and the need for graphical layers of sacrifice and structure [ 23 ].…”

Section: Introductionmentioning

confidence: 99%

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A Simple Method for Fabricating Ink Chamber of Inkjet Printheads

Huang

Tang²,

Liu

et al. 2022

Micromachines

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The process of fabricating chambers is becoming more important for inkjet printheads. However, there are some problems with the majority of present fabrication methods, such as nozzle structural deformation, blocked chambers, and collapsed chambers. In this paper, we propose a new process for preparing printhead chips by bonding tantalum nitride thin-film heaters and SU-8 chamber film using UV curing optical adhesive. This process simplifies the preparation process of printhead chips and overcomes the limitations of the traditional adhesive bonding process. Firstly, a chamber film was prepared by the molding lithography process based on a PDMS mold. The chamber film was then bonded with the membrane heater by the adhesive bonding process based on film transfer to form a thermal bubble printhead chip. Finally, the chip was integrated with other components to form a thermal inkjet printhead. The results show that the overflow width of bonding interface of 3.10 μm and bonding strength of 3.3 MPa were achieved. In addition, the printhead could stably eject polyvinyl pyrrolidone binder droplets, which are expected to be used for binder-jetting printing of powder such as ceramics, metals, and sand molds. These results might provide new clues to better understand the adhesive bonding process based on film transfer and the new applications of inkjet printheads.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

A Simple Method for Fabricating Ink Chamber of Inkjet Printheads

Huang

Tang²,

Liu

et al. 2022

Micromachines

View full text Add to dashboard Cite

show abstract

Study of SU‐8 photoresist cross‐linking process by atomic force acoustic microscopy

Zhao

Liu

Wang

et al. 2019

Journal of Microscopy

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SummaryIn this paper, a method is presented to detect the different phases of epoxy cross‐linking process and the subsurface structures of SU‐8 thin films by atomic force acoustic microscopy (AFAM). The AFAM imaging of SU‐8 thin films was investigated under different exposure and bake conditions. Optimized conditions were obtained for the cross‐linking of SU‐8 thin film at the exposure does of eight laser pulses with the laser fluence 10 mJ cm–2 per pulse and the post exposure bake (PEB) time at 90 s. The subsurface structures of undeveloped SU‐8 thin films were visible in the AFAM images. This method provides an effective and low‐cost way for the determination of different phases of epoxy cross‐linking process in nanostructured compounds, for the non‐destructive testing of subsurface defects, and for the evaluation of the quality of patterned structures.

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Fabricating chambers of inkjet printhead by bonding SU-8 nozzle plate with suitable crosslinked degree

Cited by 2 publications

References 24 publications

A Simple Method for Fabricating Ink Chamber of Inkjet Printheads

A Simple Method for Fabricating Ink Chamber of Inkjet Printheads

Study of SU‐8 photoresist cross‐linking process by atomic force acoustic microscopy

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