Extrusion printing of a designed three-dimensional YBa₂Cu₃O_7−x superconductor with milled precursor powder

Abstract

Designed milled YBCO hollow structures with high density, good mechanical properties and enhanced magnetization can prolong levitation time over magnets.

Colloidal oxide nanoparticle inks for micrometer-resolution additive manufacturing of three-dimensional gas sensors

“…So far, this approach has been applied to 3D printing of various functional oxides including dielectric, [21][22][23] piezoelectric, 24,25 optical, 26 electric conductive, 27 magnetic, 28,29 and superconductive oxides. 30,31 Among these works, the printing resolutions are limited to merely tens-tohundreds of micrometers. For example, Ander et al, 23 developed acidified TiO 2 nanoparticle inks, achieving the DIW of 3D photocatalytic structures with a minimum feature size of B200 mm for hydrogen photoproduction.…”

“…Meanwhile, no obvious deformation and shrinking-induced cracking are observed, benefitting from the proper viscoelastic properties and high-solid loading of SnO 2 nanoparticle inks. To the best of our knowledge, our ink design method has achieved the highest resolution DIW printed oxides based on nanoparticle inks, 13,21,[24][25][26][27][28][29][30]34,44,45 leading to promises for the additive manufacturing of high-performance microelectronic microdevices (Fig. 4 and Table S1, ESI †).…”

Efficient Fabrication of Ultralight YBa2Cu3O7−x Superconductors with Programmable Shape and Structure

“…[23] Mendes et al [24] produced bulk superconductor of YBCO with low-cost by 3D-printing paste-extrusion technique. Wei et al [25] produced YBCO with multiple shapes such as a hollow cylinder, gengon, and U-shaped box by 3D-printing using environmentally unfriendly pastes; the 3D-printed YBCO structures exhibited a large shrinkage rate (≈50 vol%) during sintering management. These time-and energy-intensive methods significantly limit the widespread engineering applications of YBCO.…”

Rheological study and printability investigation of titania inks for Direct Ink Writing process

“…Nowadays, AM of ceramic consists of such techniques including Direct Ink Writing (DIW) [6][7][8][9], Selective Laser Gasifying (SLG) [10], Selective Laser Sintering (SLS) [11], stereolithography (SLA) [12,13], Layer-wise Slurry Deposition (LSD) [14], Binder Jetting (BJ) [15], and replication [16]. All of these techniques have been shown to be suitable for the production of solid ceramic parts, however, DIW is widely considered as the simplest and most affordable ceramic AM technique [6][7][8][9]. Among the wide range of ceramic materials, titanium dioxide (i.e., titania) has a great potential for its biocompatibility, hardness, stiffness and heat resistance [17,18], implying almost limitless applications in industries related to food, biomedical, etc.…”