2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) 2013
DOI: 10.1109/eptc.2013.6745746
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Extreme high pressure and high temperature package development

Abstract: As oil and gas industries ventured further and deeper into the earth or ocean in search for new reservoirs, the requirements of depth, pressure and temperature are ever expanding. Conventionally, ceramic based hermetic sealed packaging is used for high temperature endurable package. However, for the case of highly pressurized application, the stress on the package is substantial and the hermetically sealed ceramic package cannot survive under a high pressure up to 30kpsi. To overcome this limitation, the autho… Show more

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