Extraction of Power Dissipation Profile in an IC Chip from Temperature Map

Wang, Xi; Shakouri, Ali; Farsiu, Sina; Milanfar, Peyman

doi:10.1109/stherm.2007.352405

Cited by 6 publications

(7 citation statements)

References 15 publications

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“…While the direct heat conduction problem (DHCP) of solving thermal maps from power maps is essential for thermal simulation [3], [4], the inverse heat conduction problem (IHCP) of solving power maps from thermal maps is a possible approach to obtaining power maps without the need for actual power measurements. The importance of the microarchitecture level IHCP has only been recently recognized [5], [6], [7], [8]. While the power-to-temperature mapping is a pre-silicon design step, the temperature-to-power mapping is a "closing the loop" post-silicon task, deriving the very power maps needed to characterize process variation, validate power models, and support new techniques to manage runtime power dissipation on a per-chip basis.…”

Section: Motivation For Post-silicon Power Mapsmentioning

confidence: 99%

“…Previous work on microarchitectural IHCP (named 'MIHCP' henceforth) [5], [6], [7] proposed algorithms without evaluating the impact of input temperature noise, which can come both from thermal measurement or from averaging and congregating. Fortunately, there are a number of characteristics of the MIHCP that make it more tractable than the general IHCP.…”

Section: Motivation For Post-silicon Power Mapsmentioning

confidence: 99%

“…PROPERTIES AND CHALLENGES OF MIHCP The temperature-to-power mapping is known as an 'illposed' problem in that the solution is very sensitive to input noise [9]. This high sensitivity at the microarchitecture level has not been discussed in previous work [5], [6], [7]. Appropriate optimization can only be applied once the source of the sensitivity is understood.…”

Section: Thermal Conduction In Microarchitecturementioning

confidence: 99%

“…The work in [7] proposes to derive power maps from thermal maps with image processing algorithms. Finite element simulations are still required and iterative solvers are needed.…”

Section: Analysis On Computational Complexitymentioning

confidence: 99%

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Temperature-to-power mapping

Meyer

Huang

et al. 2010

2010 IEEE International Conference on Computer Design

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Abstract-Accurate power maps are useful for power model validation, process variation characterization, leakage estimation, and power optimization, but are hard to measure directly. Deriving power maps from measured thermal maps is the inverse problem of the power-to-temperature mapping, extensively studied through thermal simulation. Until recently this inverse heat conduction problem has received little attention in the microarchitecture research community. This paper first identifies the source of difficulties for the problem. The inverse mapping is then performed by applying constraints from microarchitecture-level observations. The inherent large sensitivity of the resultant power map is minimized through thermal map-filtering and constrained least-squares optimization. Choices of filter parameters and optimization constraints are investigated and their effects are evaluated. Furthermore, the paper highlights the differences between the grid and block modeling in the inverse mapping which were often ignored by previous schemes. The proposed methods reduce the mapping error by more than 10× compared to unoptimized solutions. To our best knowledge this is the first work to quantitatively evaluate and minimize the noise effect in the temperature to power mapping problem at the microarchitecture level for both grid and block mode, and for the steady and transient case. I. MOTIVATION FOR POST-SILICON POWER MAPSThe "power wall" has become a critical performance limiter for integrated circuit design. Excessive power consumption leads to short battery life, higher utility costs, large currents in interconnect, and elevated temperatures. Moreover, the very power models which are intended to enable poweraware analysis and optimization are often inaccurate-in part because of changes in leakage power due to parameter variation-and need to be validated against silicon measurement. If they could be reliably derived, accurate power maps (the temporal and spatial power distribution) would provide an avenue not only to perform post-silicon power model validation, but also to characterize process variation over large regions, complementary to timing based methods like maximum frequency or critical path delay monitoring [1]. Per unit power consumption could also be used to inform power/energy-aware task scheduling or reconfiguration, and to capture long term wearout mechanisms and proactively eliminate potential reliability and thermal hazards.Unfortunately, direct fine grain power measurement is expensive and difficult, and event-counter based power proxies cannot capture workload induced power variation [2]. However, accurate and high resolution thermal maps (temporal and spatial temperature distribution) can be measured using infra-red (IR) cameras or thermal sensors. While the direct heat conduction problem (DHCP) of solving thermal maps from power maps is essential for thermal simulation [3], [4], the inverse heat conduction problem (IHCP) of solving power maps from thermal maps is a possible approach to obtaining power ...

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Section: Motivation For Post-silicon Power Mapsmentioning

confidence: 99%

Section: Motivation For Post-silicon Power Mapsmentioning

confidence: 99%

Section: Thermal Conduction In Microarchitecturementioning

confidence: 99%

“…The work in [7] proposes to derive power maps from thermal maps with image processing algorithms. Finite element simulations are still required and iterative solvers are needed.…”

Section: Analysis On Computational Complexitymentioning

confidence: 99%

See 2 more Smart Citations

Temperature-to-power mapping

Meyer

Huang

et al. 2010

2010 IEEE International Conference on Computer Design

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“…IHCP eliminates the need to physically measure power and relies instead on temperature measurement using infra-red sensors. However, the current approaches to IHCP, which include image processing algorithms [11] and spatially resolved imaging of microprocessor power [6], take a considerably long time to calculate power. Thermal aware mapping is a popular thermal aware design technique used to map tasks to IC processors while accounting for thermal factors such as peak temperature of processors, task load etc.…”

Section: Introductionmentioning

confidence: 99%

A multi-stage thermal management strategy for 3D multicores

Suresh

Singh

Kumar

2014

2014 25nd IEEE International Symposium on Rapid System Prototyping

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3D integration technology has the potential to enhance IC performance, improve functionality and lessen wiring of ICs. However, it poses several challenges, where the key challenge is heat generation from internal active layers due to power dissipation. To mitigate this challenge, thermal aware design has become a necessity. Towards thermal aware design, this paper proposes a two stage design technique. In the first stage, a temperature-power thermal model is created to calculate power dissipated by an IC at an input temperature. The proposed model calculates power dissipated by 2D and 3D ICs with an average error of 0.37% and 25% respectively. Power calculation helps in process variation, validation of power models and minimization of temperature gradients. In the second stage, thermal aware mapping is performed for the ICs. For thermal aware mapping, three mapping algorithms are proposed to account for different resource (processor) availability scenarios. Each algorithm utilizes temperature-power thermal model (from the first design stage) to map applications to processing elements in a 3D IC. The proposed two stage design technique performs faster temperature to power calculations than existing techniques. It provides a simplified approach to mapping compared to existing techniques by utilizing power dissipated by processing elements to map applications.

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