2017
DOI: 10.1016/j.sse.2016.12.003
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Extraction method for parasitic capacitances and inductances of HEMT models

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Cited by 12 publications
(8 citation statements)
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“…The network‐based extraction techniques are still challenging and need for further improvements due to the diversity of process technologies. By using open/short/through test structures, the parasitic capacitances and inductances can be determined directly . The intrinsic elements can be extracted after de‐embedding the parasitic.…”
Section: Introductionmentioning
confidence: 99%
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“…The network‐based extraction techniques are still challenging and need for further improvements due to the diversity of process technologies. By using open/short/through test structures, the parasitic capacitances and inductances can be determined directly . The intrinsic elements can be extracted after de‐embedding the parasitic.…”
Section: Introductionmentioning
confidence: 99%
“…By using open/short/through test structures, the parasitic capacitances and inductances can be determined directly. [4][5][6][7][8] The intrinsic elements can be extracted after de-embedding the parasitic. The test structure methods need additional open/short/through structures for each device size, and more chip area is needed.…”
Section: Introductionmentioning
confidence: 99%
“…14,15 Furthermore, many of the reported approaches addressed the extraction methodology based on de-embedding structures, cold FET condition, and neural network to model GaN devices. [16][17][18][19][20][21][22][23][24] In these reports, one of the extraction procedures was based on a two-step optimization process. [16][17][18][19][20][21] In such techniques, first the starting values were found either from measurements or using genetic algorithm, and then simplex algorithm technique was employed to find the optimal values for each element.…”
Section: Introductionmentioning
confidence: 99%
“…For example, iterative procedures that considered the effect of channel capacitance provided very good accuracy at a wide range of bias conditions . Furthermore, many of the reported approaches addressed the extraction methodology based on de‐embedding structures, cold FET condition, and neural network to model GaN devices . In these reports, one of the extraction procedures was based on a two‐step optimization process .…”
Section: Introductionmentioning
confidence: 99%
“…An increasing number of publications are testament to the appeal of machine learning in device modelling. It is, therefore, an emerging and appropriate alternate technique to the conventional equivalent circuit-based modelling methods [5][6][7][8][9][10][11][12][13][14] that can be used for modelling the microwave devices. It essentially aids in modelling the devices based on data approximation.…”
Section: Introductionmentioning
confidence: 99%