Exposed Die Fan-Out Wafer Level Packaging by Transfer Molding

Kersjes, Sebastiaan; Zijl, J.L.J.; Jong, Nico de; Wensink, H.

doi:10.23919/iwlpc.2018.8573283

2018 International Wafer Level Packaging Conference (IWLPC) 2018

DOI: 10.23919/iwlpc.2018.8573283

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Exposed Die Fan-Out Wafer Level Packaging by Transfer Molding

Sebastiaan Kersjes

J.L.J. Zijl

Nico de Jong

et al.

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2020

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“…Extensive research is, however, available in the field of 1st level packaging with encapsulations manufactured by transfer molding [3,4] and as a part of the Cornell injection molding program (CIMP), especially report 16 [5]. Further literature is also available relating to wafer-level encapsulations [6][7][8][9]. An approach for the reliability analysis can be derived according to a standard operating procedure used for microsystem technology in the automotive sector, as also used in [10].…”

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Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding

Kulkarni

Soltani

Wappler

et al. 2020

JMMP

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A drastically growing requirement of electronic packages with an increasing level of complexity poses newer challenges for the competitive manufacturing industry. Coupled with harsher operating conditions, these challenges affirm the need for encapsulated board-level (2nd level) packages. To reduce thermo-mechanical loads induced on the electronic components during operating cycles, a conformal type of encapsulation is gaining preference over conventional glob-tops or resin casting types. The availability of technology, the ease of automation, and the uncomplicated storage of raw material intensifies the implementation of thermoset injection molding for the encapsulation process of board-level packages. Reliability case studies of such encapsulated electronic components as a part of board-level packages become, thereupon, necessary. This paper presents the reliability study of exemplary electronic components, surface-mounted on printed circuit boards (PCBs), encapsulated by the means of thermoset injection molding, and subjected to cyclic thermal loading. The characteristic lifetime of the electronic components is statistically calculated after assessing the probability plots and presented consequently. A few points of conclusion are summarized, and the future scope is discussed at the end. carried out as a part of a chalked out design of experiments (DoE) with PCBs of different transition temperatures (125 • C and 170 • C) and different encapsulation thicknesses (0.25 to 1 mm) to evaluate the implementation of thermoset injection molding as an alternative to other dominant methods for the purpose of the encapsulation of board-level packages. An example of such an encapsulated package is shown in Figure 1. The definition of levels of packaging (here, 2nd level package) is taken from [2] and was also summarized in [1]. As mentioned already in [1], extensive literature is not available on this particular topic (encapsulation of 2nd level packages with the help if thermoset injection molding). Extensive research is, however, available in the field of 1st level packaging with encapsulations manufactured by transfer molding [3,4] and as a part of the Cornell injection molding program (CIMP), especially report 16 [5]. Further literature is also available relating to wafer-level encapsulations [6][7][8][9]. An approach for the reliability analysis can be derived according to a standard operating procedure used for microsystem technology in the automotive sector, as also used in [10]. This procedure is explained in the Sections 2.4 and 2.5. Useful tips and relevant information about board-level reliability of different components (without 2nd level encapsulation) are available in different sources [11][12][13][14][15][16][17][18][19]. These sources lay out the best practices used for defining and testing board-level reliability, involving the reliability analysis of commonly used components like ball grid arrays (BGAs) [13,16], quad-flat no-leads packages (QFN) [11,15], and thin small outline packages [17]. The effect of...

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confidence: 99%

Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding

Kulkarni

Soltani

Wappler

et al. 2020

JMMP

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Exposed Die Fan-Out Wafer Level Packaging by Transfer Molding

Cited by 1 publication

References 2 publications

Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding

Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding

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