Exploring Trade-offs in Thermal Interface Materials: The Impact of Polymer-Filler Interfaces on Thermal Conductivity and Thixotropy

Zhang, Bin; Dou, Zheng-Li; Zhang, Yong-Zheng; Fu, Qiang; Wu, Kai

doi:10.1007/s10118-024-3101-0

Cited by 6 publications

(2 citation statements)

References 51 publications

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“…Meanwhile, the BOPP/LM-BN has a much higher thermal conductivity (4.1 W m − 1 K − 1 ) than that of BOPP/BN (2.6 W m − 1 K − 1 ) which can improve the high-temperature performance of devices (Supplementary Fig. 27) 42 . The raw materials cost of our composite capacitor lm (around $6.0/kg) is much lower than other BOPP alternating materials ($11.0/kg to 350.0/kg) (Supplementary Table.…”

Section: Capacitive Application In Composite Lm Capacitormentioning

confidence: 99%

Liquid metal interface mechanochemistry disentangles energy density and biaxial-stretchability tradeoff in composite capacitor film

Wu,

Xie,

Zhu

et al. 2024

Preprint

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Dielectric polymer composites for film capacitors have advanced significantly in recent decades, yet their practical implementation in industrial-scale, thin-film processing faces challenges, particularly due to limited biaxial stretchability. Here, we introduce a mechanochemical solution that applies liquid metal onto rigid dielectric fillers (e.g. boron nitride), dramatically transforming polymer-filler interface characteristics. This approach significantly reduces modulus mismatch and stress concentration at the interface region, enabling polypropylene composites to achieve biaxial stretching ratio up to 450×450%. Furthermore, liquid metal integration enhances boron nitride's dielectric polarization while maintaining inherent insulation, producing high-dielectric-constant, low-loss films. These films, only microns thick yet quasi square meters in area, achieve a 55% increase in energy density over commercial biaxially-oriented polypropylene (from 2.9 to 4.5 J cm-3 at 550 MV/m), keeping 90% discharge efficiency. Coupled with improved thermal conductivity, durability, and device capacitance, this distinctive interface engineering approach makes these composites promising for high-performance film capacitors.

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Section: Capacitive Application In Composite Lm Capacitormentioning

confidence: 99%

Liquid metal interface mechanochemistry disentangles energy density and biaxial-stretchability tradeoff in composite capacitor film

Wu,

Xie,

Zhu

et al. 2024

Preprint

Self Cite

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“…The establishment of reliable interfacial connections between hard materials (such as electrodes) and soft materials (such as biological tissues) is becoming increasingly important. − Adhesion properties and thermal resistance at soft/hard material interfaces have been the most significant bottlenecks for the improvement of interfacial reliability, which are critical for a wide range of applications like electronic packaging, batteries, e-skin, and energy storage, to name a few. − On the one hand, an interface with high adhesion ability can provide enhanced safety and longevity of components and devices, because an interface with the desired adhesion performance can prevent them from failure, due to various stresses during application, such as vibration and bending. , On the other hand, an interface with low interfacial thermal resistance can reduce the interfacial temperature difference − and thus protects the soft/hard interconnects from thermal loads in operation and ensure survivability over the useful life. − Designing soft–hard interfaces with high adhesion performance and low interface thermal resistance is of great significance.…”

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confidence: 99%

Design of Soft/Hard Interface with High Adhesion Energy and Low Interfacial Thermal Resistance via Regulation of Interfacial Hydrogen Bonding Interaction

Zeng,

Liang,

Cheng

et al. 2024

Nano Lett.

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Adhesion ability and interfacial thermal transfer capacity at soft/hard interfaces are of critical importance to a wide variety of applications, ranging from electronic packaging and soft electronics to batteries. However, these two properties are difficult to obtain simultaneously due to their conflicting nature at soft/hard interfaces. Herein, we report a polyurethane/silicon interface with both high adhesion energy (13535 J m–2) and low thermal interfacial resistance (0.89 × 10–6 m2 K W–1) by regulating hydrogen interactions at the interface. This is achieved by introducing a soybean-oil-based epoxy cross-linker, which can destroy the hydrogen bonds in polyurethane networks and meanwhile can promote the formation of hydrogen bonds at the polyurethane/silicon interface. This study provides a comprehensive understanding of enhancing adhesion energy and reducing interfacial thermal resistance at soft/hard interfaces, which offers a promising perspective to tailor interfacial properties in various material systems.

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Thermal interface materials: From fundamental research to applications

Wei,

Luo,

et al. 2024

SusMat

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The miniaturization, integration, and high data throughput of electronic chips present challenging demands on thermal management, especially concerning heat dissipation at interfaces, which is a fundamental scientific question as well as an engineering problem—a heat death problem called in semiconductor industry. A comprehensive examination of interfacial thermal resistance has been given from physics perspective in 2022 in Review of Modern Physics. Here, we provide a detailed overview from a materials perspective, focusing on the optimization of structure and compositions of thermal interface materials (TIMs) and the interact/contact with heat source and heat sink. First, we discuss the impact of thermal conductivity, bond line thickness, and contact resistance on the thermal resistance of TIMs. Second, it is pointed out that there are two major routes to improve heat transfer through the interface. One is to reduce the TIM's thermal resistance (RTIM) of the TIMs through strategies like incorporating thermal conductive fillers, enhancing interfacial structure and treatment techniques. The other is to reduce the contact thermal resistance (Rc) by improving effective interface contact, strengthening bonding, and utilizing mass gradient TIMs to alleviate vibrational mismatch between TIM and heat source/sink. Finally, such challenges as the fundamental theories, potential developments in sustainable TIMs, and the application of AI in TIMs design are also explored.

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Exploring Trade-offs in Thermal Interface Materials: The Impact of Polymer-Filler Interfaces on Thermal Conductivity and Thixotropy

Cited by 6 publications

References 51 publications

Liquid metal interface mechanochemistry disentangles energy density and biaxial-stretchability tradeoff in composite capacitor film

Liquid metal interface mechanochemistry disentangles energy density and biaxial-stretchability tradeoff in composite capacitor film

Design of Soft/Hard Interface with High Adhesion Energy and Low Interfacial Thermal Resistance via Regulation of Interfacial Hydrogen Bonding Interaction

Thermal interface materials: From fundamental research to applications

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