Abstract:Optimal color weighting (OCW) is a promising technique to improve accuracy and robustness of alignment mark measurement in the lithography process. Measurement based OCW shows remarkable improvement of overlay error under laboratory conditions. In those conditions, one of the wafer processes is split and a simple form of mark deformation is present. However, the OCW effect has not been confirmed in the case of on-product overlay since various of deformations are mixed in the real FAB. We perform simple simulat… Show more
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