Experiments on X-ray lithography using synchrotron radiation from the VEPP-2M storage ring

Optimization of x-ray lithography conditions for fabrication of large arrays of high-aspect-ratio submicron pores

“…These conditions are presented in several works [9][10][11][12], which have paved the way for the x-ray lithography used in the present work. This coincided with the development of x-ray resists [13,14] optimized for the lithographic process, namely those with submicrometer resolution and relatively high sensitivity. X-ray-lithography was further developed in the works by Guckel and Betz [15,16].…”

Development and characterization of ultra high aspect ratio microstructures made by ultra deep X-ray lithography

“…The film caused increased roughness for larger microstructures, and it vanishes in the case of the smallest microstructure. Spiller and Feder (1977) estimated and Gluskin et al (1983) elaborated that both diffraction of X-rays and photo-electrons limit mainly the transversal resolution of X-ray lithography. However, the contribution of photoelectrons becomes dominant due to the increase of actinic photon energy with the resist layer thickness.…”