Experimental Thermal Characterisation of Electronic Packages in a Fluid Bath Environment

Christiaens, F.; Beyne, Eric; Temmerman, W. M.; Allaert, K.; Nelemans, W.

doi:10.1007/978-94-011-5506-9_13

Cited by 9 publications

(1 citation statement)

References 7 publications

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“…Typically, this is found to be significantly larger than values from both previous sources described above. Impingement (SDJI) method we consider it nevertheless worthwhile to spend a Section on this test method because under circumstances, a fluid bath test has some benefits, and hence documenting the research has certain archival value. Christiaens et al 4 examined the existing fluid bath standard (SEMI G43-87) for thermal characterization of packages. The fluid-bath standard, described in APPENDIX C recognizes that the temperature on the package surface is far from the bulk temperature of the fluid.…”

Section: Uncertainty Analysis Applied To Thermal Resistancementioning

confidence: 99%

Experimental Calibration of Compact Thermal Models

Lasance

Sabry

Bar‐Cohen

2014

Encyclopedia of Thermal Packaging

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The methods and results reported in this chapter derive primarily from the DELPHI, SEED and PROFIT projects with the exception of the final part that is devoted to recent transient tests. The following sections describe the criteria developed to assess the suitability of novel experimental techniques for package characterization, the protocol devised for estimating the uncertainty in the experimental results generated during the project, and the novel experimental techniques that were developed. The Chapter concludes with a discussion of the developments in experimental characterization that have taken place post-DELPHI, including transient tests.

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Section: Uncertainty Analysis Applied To Thermal Resistancementioning

confidence: 99%

Experimental Calibration of Compact Thermal Models

Lasance

Sabry

Bar‐Cohen

2014

Encyclopedia of Thermal Packaging

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Validation of numerical models of ceramic pin grid array packages

O’Flaherty

Cahill

Rodgers

et al. 1997

Microelectronics Journal

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DELPHI-a status report on the European-funded project for the development of libraries and physical models for an integrated design environment

Rosten¹

1996 Proceedings 46th Electronic Components and Technology Conference

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The accurate prediction o f the operatkg temperatures of critical electronic parts at the component-, board-and system-level is seriously hampered by the lack of reliable, standardised input data. This paper reports on the status of work-in-progress in the 3-year European collaborative project, named DELPHI, whose goal is to solve the aforementioned problem. The project concerns the creation and experimental validation of thermal models (detailed and compact) of a range of electronic parts including mono-chip packages, heat sinks, electrolytic capacitors, transformers and interfacing materials. The purpose of this paper is to give an account of the principal project results. A bibliography of published DELPHI technical papers is provided Project Funding and PartnersThe DELPHI project which commenced in November 1993, involves six companies from five European member states. The industrial Partners are Thomson CSF, Philips CFT, Alcatel BELL and Alcatel Espace, who respectively manufacture: electronic equipment in the areas of civil and military radar; lighting and consumer electronics; telecommunications equipment; and satellite electronics. The remaining two Partners are: the Project Coordinator Flomerics (a developer of a thermal CAD tool in wide use in the electronic industry) ; and the National Microelectronics Research Centre in Ireland. DELPHI is a three-year project due to end in November 1996.Compact modelfor a mono-chip package a compact model is a thermal resistor network containing no more than 10 (say) nodes. This terminology extends to recogize that detailed models may contain compact models within them: an example of this is the representation in finite-volume software of the lead frame of a PQFP by a layer of uniform property material (Rosten, et al. [5]), an assumption separately validated by a detailed model of the lead Graine within finite-element software.Computational Fluid anamics (CFn)the method for 173 1996 ~~e c~~o n i~ Components and Technology Conference

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Experimental Thermal Characterisation of Electronic Packages in a Fluid Bath Environment

Cited by 9 publications

References 7 publications

Experimental Calibration of Compact Thermal Models

Experimental Calibration of Compact Thermal Models

Validation of numerical models of ceramic pin grid array packages

DELPHI-a status report on the European-funded project for the development of libraries and physical models for an integrated design environment

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