Experimental study on uniformity of copper layer with microstructure arrays by electroforming

Zhao, Yongfei; Qian, Shuqu; Zhang, Yong; Wan, Xiaofang; Zhang, Hua

doi:10.1007/s00170-021-06992-w

Cited by 8 publications

(2 citation statements)

References 22 publications

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“…The uneven distribution of the deposit thickness will result in a significantly reduced dimensional accuracy even the failure of the deposited M 3 features and components. Therefore, a number of investigators have made a variety of efforts to improve the deposit thickness distribution during TM-ECD.In the traditional maskless electrodeposition processes, assisting auxiliary electrode/thief electrode (cathode or anode) [ 20 , 21 , 22 , 23 , 24 ], using an electric field shield/conformal anode [ 25 ], reciprocating the cathode [ 26 ], applying modulated electric current [ 27 , 28 ], and adding appropriate additives [ 29 , 30 , 31 ] are frequently used methods to improve the deposit thickness distribution. However, these traditional methods are less effective for the TM-ECD processes, since the patterned photoresist through-masks are inherently inhomogeneous regarding the distribution of the current density and also the mass transfer rate distribution, especially when the electrodeposition is carried out via electrically filling the multiple-scale through-masks.…”

Section: Introductionmentioning

confidence: 99%

Concurrently Fabricating Precision Meso- and Microscale Cross-Scale Arrayed Metal Features and Components by Using Wire-Anode Scanning Electroforming Technique

Ming

Zhang

et al. 2023

Micromachines

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In order to improve the thickness uniformity of the electroformed metal layer and components, a new electroforming technique is proposed—wire-anode scanning electroforming (WAS-EF). WAS-EF uses an ultrafine inert anode so that the interelectrode voltage/current is superimposed upon a very narrow ribbon-shaped area at the cathode, thus ensuring better localization of the electric field. The anode of WAS-EF is in constant motion, which reduces the effect of the current edge effect. The stirring paddle of WAS-EF can affect the fluid flow in the microstructure, and improve the mass transfer effect inside the structure. The simulation results show that, when the depth-to-width ratio decreases from 1 to 0.23, the depth of fluid flow in the microstructure can increase from 30% to 100%. Experimental results show that. Compared with the traditional electroforming method, the single metal feature and arrayed metal components prepared by WAS-EF are respectively improved by 15.5% and 11.4%.

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Section: Introductionmentioning

confidence: 99%

Concurrently Fabricating Precision Meso- and Microscale Cross-Scale Arrayed Metal Features and Components by Using Wire-Anode Scanning Electroforming Technique

Ming

Zhang

et al. 2023

Micromachines

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“…Many researchers have carried out a series of studies on electrochemical deposition machining improvement [9][10][11]. Zhao proposed a hybrid electrochemical technique combining electrolysis and electroplating to manufacture micro nozzle with a speci c shape and hydrophilic.…”

Section: Introductionmentioning

confidence: 99%

A novel mask electrochemical additive and subtractive combined manufacturing technique for microstructures with high machining performance

Zhang

Deng

et al. 2022

Int J Adv Manuf Technol

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In this paper, a novel mask electrochemical additive and subtractive combined manufacturing technique was proposed. This is a machining method at the atomic level, and it can be used to produce metal microstructures with high pro le accuracy and low surface roughness. Due to the accumulation of electric eld lines during mask electrochemical deposition, the height of the edges of the microcolumns is usually twice or more the height of the central position in the deposition plane. A combined machining method based on the electric-eld constraint of the mask is thus proposed to improve the accuracy of the pro le and its surface roughness. The feasibility of the proposed method was veri ed by both simulations and experiment. The height difference between the column center and the surrounding layer on the surface of nickel microcolumns was reduced from 13 to 2 µm, and the roughness of the tops of the microcolumns was also improved. Experiments to examine electrolysis leveling were carried out to verify the correctness of the results of the simulations and theoretical calculations. Finally, the parameters were optimized using orthogonal experiments, and an array of nickel microcolumns with a diameter of 200 µm and a height of nearly 50 µm was obtained using these optimal parameters. The pro le accuracy and surface roughness of the high-precision microcolumn array were improved by using the mask electrochemical additive and subtractive combined machining technique, and a high-precision microcolumn array structure was manufactured.

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A New Approach for Applying a Non-conductive Mandrel in Electroforming of Complex Bellows-Shape

Azad

Montazerolghaem

2023

Int. J. Precis. Eng. Manuf.

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Experimental study on uniformity of copper layer with microstructure arrays by electroforming

Cited by 8 publications

References 22 publications

Concurrently Fabricating Precision Meso- and Microscale Cross-Scale Arrayed Metal Features and Components by Using Wire-Anode Scanning Electroforming Technique

Concurrently Fabricating Precision Meso- and Microscale Cross-Scale Arrayed Metal Features and Components by Using Wire-Anode Scanning Electroforming Technique

A novel mask electrochemical additive and subtractive combined manufacturing technique for microstructures with high machining performance

A New Approach for Applying a Non-conductive Mandrel in Electroforming of Complex Bellows-Shape

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