Experimental Study on Thermodynamics of the Cu-Ni-Sn-Bi Liquid Alloys

Wnuk, G.

doi:10.2478/v10172-011-0034-8

Cited by 1 publication

(1 citation statement)

References 12 publications

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“…As a new lead frame material, Cu-Ni-Sn-P alloy has the advantages of low cost, good processing performance, simple production process and excellent comprehensive performance, which can meet the market demand of middle and high-end lead frames. However, the addition of Sn element will lead to segregation behavior of the alloy [1][2][3][4] , resulting in coarse dendrites, which is not conducive to obtaining better properties and property stability of the alloy. In addition, the solid solution of Ni element has a great influence on the conductivity of the alloy [5][6][7] .…”

Section: Introductionmentioning

confidence: 99%

Effect of Ni/Sn Ratio on Microstructure and Properties of Cu-Ni-Sn-P Alloy

Chen,

Xiao,

Yuan

et al. 2024

Preprint

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Cu-1.33Ni-1.35Sn-0.08P(Ni/Sn = 1/1), Cu-0.87Ni-1.82Sn-0.08P (Ni/Sn = 1/2) and Cu-1.78Ni-0.86Sn-0.08P (Ni/Sn = 2/1) alloys were prepared to explore the effect of different Ni/Sn ratios on the microstructure and properties of the alloys. The results showed that the alloy had the best properties when Ni/Sn = 1/2. At peak aging, its tensile strength and conductivity reached 447.3 MPa and 35.5% IACS respectively. Its tensile strength was 65.1 MPa and 88.8 MPa higher than that of the alloys with Ni/Sn = 1/1 and Ni/Sn = 2/1 respectively, and its conductivity was 1.1% IACS and 3.9% IACS higher. All three alloys had obvious dendrite segregation, but the alloy with Ni/Sn = 1/2 had finer dendrites and a more uniform distribution. In addition, the precipitates in the Cu-Ni-Sn-P alloys with Ni/Sn = 1/2 and Ni/Sn = 1/1 were all granular Ni12P5 phases, and the particles of the former are finer. The precipitates in the Cu-Ni-Sn-P alloy with Ni/Sn = 2/1 were rod-shaped. The strengthening mechanisms of the three alloys were Orowan strengthening, grain boundary strengthening, solid solution strengthening and dislocation strengthening, and Orowan strengthening was dominant. The Cu-Ni-Sn-P alloy with Ni/Sn = 1/2 had finer grains and precipitates, resulting in better tensile strength and electrical conductivity.

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