2023
DOI: 10.1016/j.applthermaleng.2022.119846
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Experimental study on thermal management of surface mount device–LED chips towards applicability in a headlamp of modern cars

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Cited by 4 publications
(1 citation statement)
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“…[18] realizes adaptive control system considering thermal calibration, [19] designs robust PI controller. [20] investigates thermal degradation of solder interconnection of power LED, [21] examines thermal performance of power LED by experimentally. For high frequency application GaN switch is used in [22].…”
Section: Introductionmentioning
confidence: 99%
“…[18] realizes adaptive control system considering thermal calibration, [19] designs robust PI controller. [20] investigates thermal degradation of solder interconnection of power LED, [21] examines thermal performance of power LED by experimentally. For high frequency application GaN switch is used in [22].…”
Section: Introductionmentioning
confidence: 99%