Experimental study on the single grit interaction behaviour and brittle–ductile transition of grinding with a diamond micro-grinding tool

Cheng, Jun; Wu, Jun; Gong, Yadong; Wen, Xuelong; Wen, Quan

doi:10.1007/s00170-016-9816-5

Cited by 17 publications

(3 citation statements)

References 20 publications

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“…When the parameters of the cutting process are reasonably set, a diamond tool can follow a set path to realize the taper angle with respect to the material’s surface in the process of removing the processed material in a downward direction. This method can be used to obtain the cutting thickness (from nanometers to micrometers) so as to analyze the the mechanisms of deformation and removal of the material with different cutting thicknesses [ 11 , 12 ] simultaneously with the BDTD of the material under the current cutting conditions. For example, Fang et al used ultra-precision machining tools to conduct taper-cutting experiments on single-crystal silicon, single-crystal germanium, etc., to analyze the cutting characteristics of the materials [ 13 , 14 ].…”

Section: Introductionmentioning

confidence: 99%

A Self-Established “Machining-Measurement-Evaluation” Integrated Platform for Taper Cutting Experiments and Applications

Yang

Zhu

et al. 2021

Micromachines

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Taper-cutting experiments are important means of exploring the nano-cutting mechanisms of hard and brittle materials. Under current cutting conditions, the brittle-ductile transition depth (BDTD) of a material can be obtained through a taper-cutting experiment. However, taper-cutting experiments mostly rely on ultra-precision machining tools, which have a low efficiency and high cost, and it is thus difficult to realize in situ measurements. For taper-cut surfaces, three-dimensional microscopy and two-dimensional image calculation methods are generally used to obtain the BDTDs of materials, which have a great degree of subjectivity, leading to low accuracy. In this paper, an integrated system-processing platform is designed and established in order to realize the processing, measurement, and evaluation of taper-cutting experiments on hard and brittle materials. A spectral confocal sensor is introduced to assist in the assembly and adjustment of the workpiece. This system can directly perform taper-cutting experiments rather than using ultra-precision machining tools, and a small white light interference sensor is integrated for in situ measurement of the three-dimensional topography of the cutting surface. A method for the calculation of BDTD is proposed in order to accurately obtain the BDTDs of materials based on three-dimensional data that are supplemented by two-dimensional images. The results show that the cutting effects of the integrated platform on taper cutting have a strong agreement with the effects of ultra-precision machining tools, thus proving the stability and reliability of the integrated platform. The two-dimensional image measurement results show that the proposed measurement method is accurate and feasible. Finally, microstructure arrays were fabricated on the integrated platform as a typical case of a high-precision application.

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Section: Introductionmentioning

confidence: 99%

A Self-Established “Machining-Measurement-Evaluation” Integrated Platform for Taper Cutting Experiments and Applications

Yang

Zhu

et al. 2021

Micromachines

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“…It is well known that brittle materials undergo a transition of cutting mode from brittle to ductile when the machining scale decreases to be small enough, which is referred to as brittle-ductile cutting mode transition (BDCMT) [1,2,3]. This phenomenon has been extensively studied, e.g., its mechanisms [4,5,6], how it is affected by machining conditions [7,8,9,10], etc., due to its vital importance for achieving super smooth surfaces in ultra-precision machining of brittle materials [11].…”

Section: Introductionmentioning

confidence: 99%

Mechanism of Unstable Material Removal Modes in Micro Cutting of Silicon Carbide

2019

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This study conducts large-scale molecular dynamics (MD) simulations of micro cutting of single crystal 6H silicon carbide (SiC) with up to 19 million atoms to investigate the mechanism of unstable material removal modes within the transitional range of undeformed chip thickness in which either brittle or ductile mode of cutting might occur. Under this transitional range, cracks are always formed in the cutting zone, but the stress states cannot guarantee their propagation. The cutting mode is brittle when the cracks can propagate and otherwise ductile mode cutting happens. Plunge cutting experiment is conducted to produce a taper groove on a 6H SiC wafer. There is a transitional zone between the brittle-cut and ductile-cut regions, which has a mostly smooth surface with a few brittle craters on it. This study contributes to the understanding of the detailed process of brittle-ductile cutting mode transition (BDCMT) as it shows that a transitional range can occur even for single crystals without internal defects and provides guidance for the determination of tcritical from taper grooves made by various techniques, e.g., to adopt larger tcritical around the end of the transitional range to increase machining efficiency for grinding or turning as long as the cracks do not extend below the machined surface.

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“…Brittle–ductile cutting mode transition is an important phenomenon in the ultra-precision machining of brittle materials [ 1 , 2 , 3 , 4 ]. Almost all the brittle materials could be machined in the ductile mode when the undeformed chip thickness (

) decreases to be sufficiently small, typically at submicron level [ 5 , 6 , 7 ].…”

Section: Introductionmentioning

confidence: 99%

A Study of Mechanics in Brittle–Ductile Cutting Mode Transition

Xiao

Ren

2018

Micromachines

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This paper presents an investigation of the mechanism of the brittle–ductile cutting mode transition from the perspective of the mechanics. A mechanistic model is proposed to analyze the relationship between undeformed chip thickness, deformation, and stress levels in the elastic stage of the periodic chip formation process, regarding whether brittle or ductile mode deformation is to follow the elastic stage. It is revealed that, the distance of tool advancement required to induce the same level of compressive stress decreases with undeformed chip thickness, and thereby the tensile stress below and behind the tool decreases with undeformed chip thickness. As a result, the tensile stress becomes lower than the critical tensile stress for brittle fracture when the undeformed chip thickness becomes sufficiently small, enabling the brittle–ductile cutting mode transition. The finite element method is employed to verify the analysis of the mechanics on a typical brittle material 6H silicon carbide, and confirmed that the distance of the tool advancement required to induce the same level of compressive stress becomes smaller when the undeformed chip thickness decreases, and consequently smaller tensile stress is induced below and behind the tool. The critical undeformed chip thicknesses for brittle–ductile cutting mode transition are estimated according to the proposed mechanics, and are verified by plunge cutting experiments in a few crystal directions. This study should contribute to better understanding of the mechanism of brittle–ductile cutting mode transition and the ultra-precision machining of brittle materials.

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Experimental study on the single grit interaction behaviour and brittle–ductile transition of grinding with a diamond micro-grinding tool

Cited by 17 publications

References 20 publications

A Self-Established “Machining-Measurement-Evaluation” Integrated Platform for Taper Cutting Experiments and Applications

A Self-Established “Machining-Measurement-Evaluation” Integrated Platform for Taper Cutting Experiments and Applications

Mechanism of Unstable Material Removal Modes in Micro Cutting of Silicon Carbide

A Study of Mechanics in Brittle–Ductile Cutting Mode Transition

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