Experimental study on the loop heat pipe with a planar bifacial wick structure

Joung, Wukchul; Yu, Tiantang; Lee, Jinho

doi:10.1016/j.ijheatmasstransfer.2007.07.048

Cited by 79 publications

(22 citation statements)

References 16 publications

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“…Presently Nickel, titanium, copper and stainless steel (Reimbrechta et al, 1999;Patukhov et al, 2003;Reay and Kew, 2006;Joung et al, 2008 andGongming et al, 2009) are the most widely used metal powders for capillary wicks. Earlier work towards development of wick for Loop heat pipe applications presents few methods.…”

Section: Introductionmentioning

confidence: 99%

DEVELOPMENT OF TUBULAR Ni WICK USED IN LHP FOR SPACE APPLICATIONS

Samanta¹,

Sharma²,

Das³

et al. 2012

Frontiers in Heat Pipes

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Present research is focused on porous tubular wick development, which is considered as the heart of the Loop heat pipes (LHP) specifically used for space applications, such as satellites and space craft's. Basic purpose of a wick is to generate capillary pumping pressure required to transport a working fluid along a two-phase heat transfer loop. Wicking structures are generally made of wire meshes or sintered metal powders. Present work establishes Metal Injection Moulding (MIM) as a potential route for the manufacturing of tubular wicks in the near-net shape form, discarding any need of further machining for creating vapour removal channels/grooves on the outer surface. Nickel powder along with polypropylene (PP) powder and thermoplastic binder consisting of paraffin wax (PW) and low density polyethylene (LDPE) are used to produce feedstock for injection moulding. Green compact of tubular wicks prepared by injection moulding is then debound and sintered to get the final porous structure. Further characterization of the tubular wicks sintered at 900 0 C for 60 minutes reveals porosity level of 55 vol%, avg. capillary pore diameter of 2.6µm, permeability of 1.94×10 -12 m 2 and thermal conductivity of 9.37 W/mK. SEM observation of wick samples shows well connected micro porous network responsible for generation of capillary pumping pressure.

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Section: Introductionmentioning

confidence: 99%

DEVELOPMENT OF TUBULAR Ni WICK USED IN LHP FOR SPACE APPLICATIONS

Samanta¹,

Sharma²,

Das³

et al. 2012

Frontiers in Heat Pipes

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“…According to the law of conservation of mass and momentum conservation law and the law of conservation of energy [4]. Viscous fluid flow satisfies the continuity equation, momentum equation, k-e equation and energy equation of basic control equation in the three-dimensional orthogonal cartesian coordinate system [5].…”

Section: Control Equationmentioning

confidence: 99%

Numerical Simulation of New Radiator in Electronic Device

2012

Electrical, Information Engineering and Mechatronics 2011

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An experimental apparatus is set up to test the heat transfer performance of the new radiator, which mainly includes vacuum-pumping and Central Processing Unit tunnel system, heating system and measurement system. The heat dissipation of the Central Processing Unit chip is imitated by the copper bar which is heated by thermal resistance wire. The experimental results showed that the temperature of the Central Processing Unit chip decreased with growth of cooling air velocity, but the temperature drop tendency became gentle when it continued to increase. Higher heat dissipation power resulted in higher CPU chip temperature, but oversized heat flux density made the phase changing process worse.

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“…Experimental investigations on LHP with flat evaporator were carried out to improve the heat transfer performance. Experiments have been performed in different operating conditions (Gai et al, 2009), with different kinds of working fluid and various wick structure design (Joung et al, 2008) to achieve the optimum heat flux removal capability. But, the two-phase fluid in the loop makes the mechanism complex.…”

Section: Introductionmentioning

confidence: 99%

Thermal Analysis and Flow Visualization of a Flat Loop Heat Pipe

Kizito¹,

Hossain²

2017

Frontiers in Heat Pipes

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Thermal management is an important issue for electronic cooling application. Choosing an efficient cooling technique depends on thermal performance, reliability, manufacturing cost, and prospects for minimization of packaging cost. A loop heat pipe with a flat evaporator and a flat gap condenser was designed and developed to evaluate the loop performance for a range of heat load. During the study, the startup process and temperature profiles at different components of loop were compared at various heat loads. Heat transfer coefficients and the thermal resistances of the loop were also measured at these loads. In the evaporator, a disc shape copper wick was able to handle 100-watt heat load with the evaporator thermal resistance of 0.14Ԩ/ܹ and heat transfer coefficient of 14.114ܹ/݉ ଶ Ԩ. To visually investigate the startup process and component performance, main structure of loop heat pipe was fabricated inside acrylic plastic block. The startup process in the vapor line, the formation of bubble inside condenser and compensation chamber during the loop heat pipe operation were visualized and explained. The visualization process helps to understand the physical phenomenon of the complete heat loop in a single frame.

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Experimental study on the loop heat pipe with a planar bifacial wick structure

Cited by 79 publications

References 16 publications

DEVELOPMENT OF TUBULAR Ni WICK USED IN LHP FOR SPACE APPLICATIONS

DEVELOPMENT OF TUBULAR Ni WICK USED IN LHP FOR SPACE APPLICATIONS

Numerical Simulation of New Radiator in Electronic Device

Thermal Analysis and Flow Visualization of a Flat Loop Heat Pipe

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