Experimental study on the improvement of surface integrity of tungsten steel using acoustic levitation polishing

Qi, Huan; Cheng, Zhichao; Cai, Donghai; Yin, Ling; Wang, Zhengwei; Wen, Desheng

doi:10.1016/j.jmatprotec.2018.04.043

Cited by 23 publications

(4 citation statements)

References 24 publications

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“…To evaluate the lapping and polishing performance after the optimization of the processing parameters considered in this study, a set of nanoindentation tests have been conducted to phenomenon could be improved by the optimization of the processing parameters to control the surface integrity (Qi et al, 2018). In addition, Figure 6 shows the comparison of the hardness test results before and after the optimization of the lapping and polishing parameters.…”

Section: Evaluation Of the Lapping And Polishing Performance For Nano...mentioning

confidence: 99%

Optimization of Lapping and Polishing of Steel Samples for Nanoindentation Based on SVM-GA

Cheng

2022

Front. Mater.

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The nanoindentation test is extensively used to obtain the mechanics performance of different kinds of materials. In this study, the general process in the lapping and polishing of Q235 steel samples for nanoindentation has been analyzed by considering the pressure (P), rotation speed of the lapping and polishing plate (rp), flow rate of abrasive slurry (Qa), and the processing time (t). It is found from the lapping experiments with a full factorial design that the optimized processing parameters are rp of 200 r/min, P of 30 N, and t of 4 min considered in this study by considering the material removal rate and subsurface damage. The central composite design method has been used to design the polishing experiments, and the support vector machine (SVM) method has been used to deal with these experimental results, and it is found that the developed SVM model can accurately predict the surface roughness under different processing parameters. Then, based on the SVM model, the genetic algorithm (GA) method is used to obtain the optimized processing parameters in the polishing process, and it is found from the SVM-GA study that the optimized processing parameters in the lapping process are rp of 108 r/min, P of 33 N, Qa of 20 ml/min, and t of 3 min. Finally, a set of nanoindentation tests have been conducted to evaluate the lapping and polishing performance, and it is found that the surface integrity has been significantly improved after the optimization of the lapping and polishing parameters by using the SVM-GA method considered in this study.

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Section: Evaluation Of the Lapping And Polishing Performance For Nano...mentioning

confidence: 99%

Optimization of Lapping and Polishing of Steel Samples for Nanoindentation Based on SVM-GA

Cheng

2022

Front. Mater.

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“…The material removal rate increased by 380% compared with traditional fluid processing. Qi et al [ 18 ] proposed an ultrasonic vibration suspension polishing method, which uses a standing-wave ultrasonic field to form the high and low ultrasonic pressure region, induces abrasive impact in the polishing fluid to achieve material removal, and performs polishing experiments on tungsten steel, effectively reducing the workpiece surface roughness and reducing the workpiece surface residual stress. Yu et al [ 19 ] proposed an ultra-smooth surface-processing method based on two-dimensional fluid vibration.…”

Section: Introductionmentioning

confidence: 99%

Material Removal Characteristics of Spherical-Array-Focused Ultrasonic Abrasive Machining

Wang

Yuan

et al. 2023

Micromachines

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To improve the ultrasonic energy and realize far-field ultrasonic abrasive machining of complex surfaces, a spherical-array-focused ultrasonic abrasive machining system was established. By combining ultrasonic field simulation, detection and a single-factor experiment, the influences of the ultrasonic generator current, abrasive concentration, and particle size on the material removal properties and surface quality evolution of quartz glass were investigated. When the current was less than 0.4 A, the material removal showed plastic removal at the nanoscale. When the current was more than 0.5 A, the cavitation phenomenon formed micron-scale impact removal traces on the workpiece surface. The increase in abrasive concentration increased the impact density and material removal rate, while excessive abrasive concentration increased the impeding effect between abrasive particles and reduced the material removal rate. Moreover, the increase in abrasive particle concentration enhanced heterogeneous cavitation nucleation, promoted the removal of abrasive impact materials under the action of a cavitation jet, and inhibited the removal of direct surface cavitation. The abrasive particle size affects the heterogeneous cavitation nucleation and the acceleration of the cavitation jet on abrasive particles, which affects the material removal rate and surface quality. By controlling the energy of the focused ultrasound and abrasive parameters, the plastic or brittle domain removal of quartz glass can be achieved at the micro- and nanoscales.

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“…Numerical simulation is alternatively used to investigate some dynamic and complicated problems that cannot be addressed experimentally [ 14 , 15 , 16 , 17 ]. DEM, treating the brittle materials as a solid specimen with arbitrarily sized spherical elements bonded together with the assistance of the BPM (Bonded Particle Model), can model mechanical behaviour subjected to external force or moment, which are mainly governed by the formation, propagation and eventual intersection of cracks [ 13 ].…”

Section: Introductionmentioning

confidence: 99%

A Novel Grain-Based DEM Model for Evaluating Surface Integrity in Scratching of RB-SiC Ceramics

Wang

et al. 2022

Materials

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A novel grain-based DEM (Discrete Element Method) model is developed and calibrated to simulate RB-SiC (Reaction-Bonded Silicon Carbide) ceramic and associated scratching process by considering the bonded SiC and Si grains and cementitious materials. It is shown that the grain-based DEM model can accurately identify transgranular and intergranular cracks, and ductile and brittle material removal modes. It also shows that by increasing the scratching speed or decreasing the depth of cut, the maximum depth of subsurface damage decreases, because the scratching force is relatively large under the low scratching speed or large depth of cut that facilitates the occurrence of transgranular cracks, large grain spalling from the target surface and the propagation of median cracks into the target subsurface. It has further been found that increasing the cutting-edge radius can enhance the target ductile machinability and reduce the target subsurface damage.

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Experimental study on the improvement of surface integrity of tungsten steel using acoustic levitation polishing

Cited by 23 publications

References 24 publications

Optimization of Lapping and Polishing of Steel Samples for Nanoindentation Based on SVM-GA

Optimization of Lapping and Polishing of Steel Samples for Nanoindentation Based on SVM-GA

Material Removal Characteristics of Spherical-Array-Focused Ultrasonic Abrasive Machining

A Novel Grain-Based DEM Model for Evaluating Surface Integrity in Scratching of RB-SiC Ceramics

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