Experimental study on the heat transfer characteristics of waste printed circuit boards pyrolysis

Ma, Hongting; Du, Na; Lin, Xueyin; Li, Chen; Lai, Junwen; Li, Zihao

doi:10.1016/j.scitotenv.2018.03.180

Cited by 19 publications

(9 citation statements)

References 23 publications

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“…Moreover, it seems that little is known on the effect of pyrometallurgical processes being applied before the initial physical processing, particularly regarding the investigation of low-temperature processing effects on PCB constituent separation. For instance, Ma et al (2018) [ 49 ] assessed this type of processing from a heat transfer perspective while Guo et al (2014) [ 50 ] dealt with calorific capacities of a PCB sample. In praxis, the typical pyrometallurgical processes are furnace smelting and alkali fusion, according to Chauhan et al (2018) [ 35 ] and Ding et al (2019) [ 51 ].…”

Section: Introduction and Literature Reviewmentioning

confidence: 99%

Electronic Waste Low-Temperature Processing: An Alternative Thermochemical Pretreatment to Improve Component Separation

et al. 2021

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The production of electronic waste due to technological development, economic growth and increasing population has been rising fast, pushing for solutions before the environmental pressure achieves unprecedented levels. Recently, it was observed that many extractive metallurgy alternatives had been considered to recover value from this type of waste. Regarding pyrometallurgy, little is known about the low-temperature processing applied before fragmentation and subsequent component separation. Therefore, the present manuscript studies such alternative based on scanning electron microscopy characterization. The sample used in the study was supplied by a local recycling center in Rio de Janeiro, Brazil. The mass loss was constant at around 30% for temperatures higher than 300 °C. Based on this fact, the waste material was then submitted to low-temperature processing at 350 °C followed by attrition disassembling, size classification, and magnetic concentration steps. In the end, this first report of the project shows that 15% of the sample was recovered with metallic components with high economic value, such as Cu, Ni, and Au, indicating that such methods could be an interesting alternative to be explored in the future for the development of alternative electronic waste extraction routes.

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Section: Introduction and Literature Reviewmentioning

confidence: 99%

Electronic Waste Low-Temperature Processing: An Alternative Thermochemical Pretreatment to Improve Component Separation

et al. 2021

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“…However, the structure and size of existing heating hole are often determined according to experiences. 22…”

Section: Introductionmentioning

confidence: 99%

“…Many researchers have studied the fusion mode of solder, for example, using air and certain liquids as heating medium for effective removal of solder joints. [21][22][23][24] The air heating technology is widely used in disassembly for components welded on PCB surface. During disassembling process, hot air is sprayed onto PCB by nozzle and the solder joints are melted when hot air goes through some heating holes to realize thermal convection.…”

Section: Introductionmentioning

confidence: 99%

“…However, the structure and size of existing heating hole are often determined according to experiences. 22 As above mentioned, many scientific research departments and universities have carried out research experiments on waste PCB disassembly. However, the research focuses on the disassembly process of components on a single circuit board, and the energy utilization efficiency improvement of related equipment has not been involved in detail.…”

Section: Introductionmentioning

confidence: 99%

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Structure analysis of the conical heating hole for waste printed circuit boards disassembly

Yin

Chang

et al. 2020

Proceedings of the Institution of Mechanical Engineers, Part C:

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The component disassembling technology of printed circuit board is taking on more importance in the field of electronic waste disassembly. When disassembling electronic components from waste printed circuit board, its implementation programs are to inject hot air into printed circuit board through spray nozzle and melt the solder joints through thermal convection. The structure of air heating outlet for disassembling electronic components from waste printed circuit board is investigated to reduce energy consumption in solder melting process. This paper proposes a structural analysis method of conical heating holes to reduce the energy consumption of hot air and improve the temperature uniformity in solder melting process. With advantages of high efficiency and low-cost, numerical simulation method is totally used to obtain optimal dimension parameters of the conical hole from a wide range of optional parameters. The numerical simulation takes air as the heating medium and adopts the mode of heat convection under optimal melting temperature range (200–230 ℃). The optimized results of the parameters of a single conical hole and multiple conical holes are obtained based on numerical simulation. When the distance between the inlet and the substrate is 50 mm, the optimal inlet temperature and velocity are 235 ℃ and 8 m/s, respectively. For a single conical hole, the optimal inlet height, top diameter, and angle are 6 mm, 16 mm, and 20°, respectively. For multiple conical holes, the optimal distance between the center lines of two inlet ranges from 50 mm to 56 mm.

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“…With the development of electronics and the Internet, printed circuit board (PCB) plays a significant role in those applications and as the upstream industry of PCB, solder resist ink, which is used for protecting copper traces of PCB, preventing solder from bridging, and increasing the degree of insulation, presents a unique function in the electronics . Nowadays, traditional solder resist ink of screen printing has been replaced due to its volatile organic compounds and complex operation.…”

Section: Introductionmentioning

confidence: 99%

Synthesis of UV and thermal dual curing oligomer for solder resist ink using ink‐jet printing

Liang

Wang

Feng

et al. 2018

J of Applied Polymer Sci

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A novel solder resist ink for inkjet printing containing the ultraviolet (UV) and thermal dual curing oligomer is introduced in this work. Three kinds of acrylic monomers for the synthesis of the oligomer are successful prepared and their structures are determined by Fourier transfer infrared. Both UV curing process and thermostability are monitored under UV differential scanning calorimetry and thermogravimetric analysis. For the photoreaction process, the oligomer using Lauryl methacrylate as the material of copolymerization possesses the highest reactivity and conversion of carbon-carbon double bond. Besides, this kind of oligomer also owns excellent thermostability, just losing 5.9% of its weight at 288 C. The solder resist inks containing the oligomers and jetting by the inkjet printer are tested with the adhesion, soldering resistance, and other performances, presenting the outstanding heat resistance and wide application prospects.

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Experimental study on the heat transfer characteristics of waste printed circuit boards pyrolysis

Cited by 19 publications

References 23 publications

Electronic Waste Low-Temperature Processing: An Alternative Thermochemical Pretreatment to Improve Component Separation

Electronic Waste Low-Temperature Processing: An Alternative Thermochemical Pretreatment to Improve Component Separation

Structure analysis of the conical heating hole for waste printed circuit boards disassembly

Synthesis of UV and thermal dual curing oligomer for solder resist ink using ink‐jet printing

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