Experimental study on the effect of nano zirconia on mechanical strength and microstructure of damaged epoxy-nanocomposites

Rostamiyan, Yasser; Youseftabar, Hamed; Azadi, Reza

doi:10.1088/2053-1591/aaef67

Cited by 11 publications

(4 citation statements)

References 36 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The Sn-Pb solder widely used in the traditional electronic packaging industry has exposed its disadvantages, such as too high solder welding temperature, easy to damage devices, too low line resolution, unfriendly to the environment and so on. The ECA has the advantages of environmentally friendly, less processing steps, narrow processing width and low temperature, which has attracted widespread attention [1][2][3][4]. The ECA is the main substitute for Sn-Pb solder and has become an indispensable new material in the electronic industry [5][6][7].…”

Section: Introductionmentioning

confidence: 99%

WITHDRAWN: Preparation of Silver Nanopowders and Its Application in Low Temperature Electrically Conductive Adhesive

Zhang

Yang

Wang

2021

Preprint

View full text Add to dashboard Cite

Printable electrically conductive adhesive with high electrical conductivity and good mechanical properties has wide application prospect in electronic device. In order to explore new conductive fillers of interconnecting materials in electronic circuit and electronic packaging industries, silver nanopowders were prepared by DC arc plasma method with high pure. The silver nanopowders present a spherical structure, the particle’s diameter range from 15 to 220 nm. In this paper, a high performance electrically conductive adhesive (ECA) was prepared. This ECA was fabricated by mixing silver nanopowders with epoxy resin and was screen-printed to a required shape. It was found that the ECA can be solidified through a low temperature sintering method in the air at 150 ℃ for 10 min. The electrical and mechanical of above ECA were investigated and characterized. The ECA filled with 75% silver nanopowders exhibits excellent performances, including high electrical conductivity (9.5×10-4 Ω·cm), high bonding strength ( 8.3 MPa). Based on the performance characteristics, the ECA applications in flexible printed electrodes and interconnecting materials are demonstrated.

show abstract

Section: Introductionmentioning

confidence: 99%

WITHDRAWN: Preparation of Silver Nanopowders and Its Application in Low Temperature Electrically Conductive Adhesive

Zhang

Yang

Wang

2021

Preprint

View full text Add to dashboard Cite

show abstract

“…Fiber reinforced polymer (FRP) composites have been used to replace conventional materials such as steel in various industries such as marine, automotive, aerospace, and construction. 1–3 Glass fibers are the most common reinforcement used for FRP composites in comparing with the other kinds of synthetic fibers because they possess excellent properties such as high strength and low cost. Epoxy resin is widely used as a host matrix for FRP composites due to its high elastic modulus, considerable rupture strength, and low creep.Epoxy resin produces thermosetting matrix composites, displaying several interesting properties like good stiffness and specific strength, dimensional stability, chemical resistance, low viscosity, and good wetting ability.…”

Section: Introductionmentioning

confidence: 99%

Development of beneficial residual stresses in glass fiber epoxy composites through fiber prestressing

Mohamed

Brahma

Ning

et al. 2020

Journal of Reinforced Plastics and Composites

View full text Add to dashboard Cite

The undesired residual stresses in fiber reinforced polymer composites are developed during their manufacturing processes due to the thermal and chemical shrinkage of the polymer matrix, which negatively affect the performance of the composites. Applying tensile stress to the reinforcement fibers during the curing of the matrix can reduce or eliminate the undesired residual stresses. Furthermore, the undesired tensile residual stress within the matrix can be replaced with beneficial compressive residual stress which can improve the mechanical properties of the composites. In this study, theoretical stress analysis was performed in order to determine the value of the optimum compressive residual stress that is associated with the highest tensile strength. This value was determined based on the tensile testing result of prestressed composites with a 40% fiber volume fraction. For the composites with different fiber volume fractions, a new approach was introduced to estimate the optimum fiber prestressing level which generates the optimum compressive residual stress within the matrix and consequently, the highest tensile strength can be achieved. In order to validate this approach experimentally, prestressed composites with 25 and 30% fiber volume fraction were prepared by applying the estimated optimum fiber prestressing levels during curing of matrix and tensile testing was performed. The result of the stress analysis showed that the value of the optimum compressive residual stress corresponding to the highest tensile strength is 2.5 MPa approximately. The tensile testing results confirmed the validity of the new approach in estimating the optimum fiber prestressing level for the composites with different fiber volume fractions. For both prestressed composites with 25 and 30% fiber volume fraction, the highest tensile strength was achieved when the theoretically estimated optimum fiber prestressing level was applied to the fibers during the curing of the matrix.

show abstract

“…A variety of methods and material systems related to self-healing have been developed, and there are many materials that can deal with damages or failures [6][7][8]. Compared with "classic" materials, such as epoxy resins and their composites [9][10][11], the self-healing materials can be repaired and do not need obvious human intervention when damages or failures occur. These selfhealing materials may remind us of scenes that often appear in science fictions, like higher regenerability, longer service life, less maintenance (time and cost), more security and better performance.…”

Section: Introductionmentioning

confidence: 99%

A novel kind of room temperature self-healing poly(urethane-urea) with robust mechanical strength based on aromatic disulfide

Song

et al. 2021

J Polym Res

View full text Add to dashboard Cite

An innovative poly(urethane-urea) elastomer, which exhibited excellent stretchability, thermal stability and autonomous self-healing abilities, was synthesized from the commercially available poly(propylene glycol) (PPG), isophorone diisocyanate (IPDI), 2,4 / 2,6-toluene diisocyanate (80: 20, w / w) (TDI-80) and bis (2-aminophenyl) disulfide (DSDA). This aromatic disulfide containing poly(urethane-urea) (ss-PUs) achieved both rapid room temperature self-healing abilities and robust mechanical strength (the ultimate tensile strength was up to 4.20 ± 0.10 MPa and elongation at break was up to 954 ± 35.6%), through facile metathesis of the aromatic disulfides which embedded in hard segments. After the ss-PUs was cut into two-halves and reconnected, the mechanical properties could recover to ~ 90% of those of the original samples within 12 h at room temperature without extra self-healing agents or any change of environmental conditions.

show abstract

Experimental study on the effect of nano zirconia on mechanical strength and microstructure of damaged epoxy-nanocomposites

Cited by 11 publications

References 36 publications

WITHDRAWN: Preparation of Silver Nanopowders and Its Application in Low Temperature Electrically Conductive Adhesive

WITHDRAWN: Preparation of Silver Nanopowders and Its Application in Low Temperature Electrically Conductive Adhesive

Development of beneficial residual stresses in glass fiber epoxy composites through fiber prestressing

A novel kind of room temperature self-healing poly(urethane-urea) with robust mechanical strength based on aromatic disulfide

Contact Info

Product

Resources

About