Experimental study on surface topography and fracture strength of worn saw wire in multi-wire sawing

Li, Zhen; Wang, Minjie; Cai, Yuanwen; Jia, Haili

doi:10.1007/s00170-017-0854-4

Cited by 7 publications

(3 citation statements)

References 15 publications

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“…In multi-wire sawing, reducing wire wear and managing wire consumption are common approaches to mitigating the risk of wire breakage, as worn wires undergo a complex process of strength degradation and surface damage. Li et al [ 115 ] investigated the surface morphology and fracture strength of worn wires to study the wear loss of different steel wires. Based on the experimental results, they further proposed a model for the maximum allowable wear limit of the wire, ensuring its safe usage during the sawing process.…”

Section: Machining Performance Of Dwsmentioning

confidence: 99%

Recent Advances in Precision Diamond Wire Sawing Monocrystalline Silicon

Zhou³

et al. 2023

Micromachines

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Due to the brittleness of silicon, the use of a diamond wire to cut silicon wafers is a critical stage in solar cell manufacturing. In order to improve the production yield of the cutting process, it is necessary to have a thorough understanding of the phenomena relating to the cutting parameters. This research reviews and summarizes the technology for the precision machining of monocrystalline silicon using diamond wire sawing (DWS). Firstly, mathematical models, molecular dynamics (MD), the finite element method (FEM), and other methods used for studying the principle of DWS are compared. Secondly, the equipment used for DWS is reviewed, the influences of the direction and magnitude of the cutting force on the material removal rate (MRR) are analyzed, and the improvement of silicon wafer surface quality through optimizing process parameters is summarized. Thirdly, the principles and processing performances of three assisted machining methods, namely ultrasonic vibration-assisted DWS (UV-DWS), electrical discharge vibration-assisted DWS (ED-DWS), and electrochemical-assisted DWS (EC-DWS), are reviewed separately. Finally, the prospects for the precision machining of monocrystalline silicon using DWS are provided, highlighting its significant potential for future development and improvement.

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Section: Machining Performance Of Dwsmentioning

confidence: 99%

Recent Advances in Precision Diamond Wire Sawing Monocrystalline Silicon

Zhou³

et al. 2023

Micromachines

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“…There are two main processing methods for hard and brittle material slicing: diameter sawing [ 1 , 2 , 3 ] and wire sawing [ 4 , 5 , 6 , 7 ]. The diameter sawing methods broadly include inner diameter sawing [ 8 , 9 , 10 ] and external diameter sawing [ 11 , 12 ].…”

Section: Introductionmentioning

confidence: 99%

Surface Quality Improvement for Ultrasonic-Assisted Inner Diameter Sawing with Six-Axis Force Sensors

Zhao

Wang

Jiang

et al. 2023

Sensors

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Ultrasonic-assisted inner diameter machining is a slicing method for hard and brittle materials. During this process, the sawing force is the main factor affecting the workpiece surface quality and tool life. Therefore, based on indentation fracture mechanics, a theoretical model of the cutting force of an ultrasound-assisted inner diameter saw is established in this paper for surface quality improvement. The cutting experiment was carried out with alumina ceramics (99%) as an exemplar of hard and brittle material. A six-axis force sensor was used to measure the sawing force in the experiment. The correctness of the theoretical model was verified by comparing the theoretical modeling with the actual cutting force, and the influence of machining parameters on the normal sawing force was evaluated. The experimental results showed that the ultrasonic-assisted cutting force model based on the six-axis force sensor proposed in this paper was more accurate. Compared with the regular tetrahedral abrasive model, the mean value and variance of the proposed model’s force prediction error were reduced by 5.08% and 2.56%. Furthermore, by using the proposed model, the sawing processing parameters could be updated to improve the slice surface quality from a roughness Sa value of 1.534 µm to 1.129 µm. The proposed model provides guidance for the selection of process parameters and can improve processing efficiency and quality in subsequent real-world production.

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“…Under normal circumstances, there are two main processing methods for ceramics slicing: diameter sawing technology [6][7][8] and wire sawing technology [9][10][11][12]. The diameter sawing technology is divided into inner diameter sawing technology [13][14][15] and external diameter sawing technology [16,17].…”

Section: Introductionmentioning

confidence: 99%