Experimental study on dressing concave trapezoidal diamond grinding wheel by electrical discharge grinding method

Dai, Longzhou; Chen, Genyu; Li, Mingquan; Yuan, Shangyong

doi:10.1016/j.diamond.2022.109218

Cited by 8 publications

(1 citation statement)

References 34 publications

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“…Rao et al [21] applied the electrical discharge grinding technology (EDGT) to the machining of RB-SiC ceramics, and effectively improved the machining efficiency and grinding surface quality of ceramic materials by taking advantage of the combined advantages of electric discharge machining and grinding. Dai et al [22] applied the processing advantages of EDGT to the dressing of formed diamond abrasive tools, and obtained a better surface topography of the grinding wheel. These studies show that EDGT has advantages in machining hard and brittle materials, and can improve machining efficiency and workpiece surface quality [23,24].…”

Section: Introductionmentioning

confidence: 99%

Study on material removal mechanism and surface formation characteristics of reaction-bonded silicon carbide by electrical discharge grinding technology

Wu,

Deng,

Lei

2023

Preprint

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Electrical discharge grinding technology (EDGT) is an efficient and high precision method for machining RB-SiC ceramic materials. In this paper, the mechanism of material removal in EDGT is deeply studied, and the formation characteristics of surface topography under different material removal methods affected by grinding depth are analyzed. A three-dimensional heat conduction analysis model in the process of single pulse discharge was established, and the temperature field distribution in RB-SiC ceramic material under different discharge energy was obtained by numerical calculation. It is found that the simulated crater radius and depth increase with the increase of the discharge time, and the material removal amount gradually increases, but the growth rate gradually decreases. In order to give full play to the advantages of EDGT, the discharge energy and grinding depth were optimized according to the material removal mechanism. Finally, RB-SiC ceramic machining experiments were carried out using the optimized machining parameters, and a smooth surface with few discharge craters was obtained. It is found that the grinding scratches on the material surface are mainly plastic grinding, and the material surface roughness is 0.443 µm. The research results of this paper can provide guidance for engineering practice of ductile grinding technology of RB-SiC ceramic materials.

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