Experimental study of the ternary Ag–Cu–In phase diagram

Thermodynamic Description of the Quaternary Ag-Cu-In-Sn System

“…The calculation agrees with Bahari et al's 109 work. There is a big difference between the phase equilibria presented in Bahari et al 110 and those presented in Woychik and Massalski's 109 work. Woychik and Massalski showed that CUIN_ GAMMA and Ag2In phases make a continuous solid solution through the whole system; however, Bahari et al 110 presented that those phases are not even in equilibrium.…”

“…There is a big difference between the phase equilibria presented in Bahari et al 110 and those presented in Woychik and Massalski's 109 work. Woychik and Massalski showed that CUIN_ GAMMA and Ag2In phases make a continuous solid solution through the whole system; however, Bahari et al 110 presented that those phases are not even in equilibrium. Bahari et al 110 proposed equilibrium between Ag2In, Cu11In9, and CUIN_ETA/ETA_ prime and equilibrium between CUIN_GAMMA, HCP_A3, and FCC_A1(Cu).…”

“…Woychik and Massalski showed that CUIN_ GAMMA and Ag2In phases make a continuous solid solution through the whole system; however, Bahari et al 110 presented that those phases are not even in equilibrium. Bahari et al 110 proposed equilibrium between Ag2In, Cu11In9, and CUIN_ETA/ETA_ prime and equilibrium between CUIN_GAMMA, HCP_A3, and FCC_A1(Cu). The different equilibrium between phases shown by these two works should motivate future work on the Ag-Cu-In ternary system.…”

“…The thermodynamic properties of the liquid phase were measured by Wierzbicka-Miernik, 106 who used electromotive measurement as well as calorimetric measurement. The phase equilibria in this system were determined by Gebhard and Dreher, 107,108 Woychik and Massalski, 109 and Bahari et al 110 The fourth ternary system is Cu-In-Sn. Thermodynamic properties of the liquid phase were determined by Fitzner, 111 Jendrzejczyk-Handzlik et al, 112 Popovic and Bencze, 113 who determined the activity of elements in the liquid phase, and Li et al, 114 who measured the mixing enthalpy of the liquid phase.…”

Effects of the degradation of methane sulfonic acid electrolyte on the collapse failure of Sn–Ag alloy solders for flip-chip interconnections

“…These tribological behaviors and the hardening effects are consistent with previous reports [26][27][28] that discussed the correlation between surface micro-hardness and the surface frictional property. Because the mechanical properties and the melting temperature of solder alloy are highly dependent on the microstructure and the composition of the solder alloy, [29][30][31] these results suggest that the degradation of the bath has a negative inuence on the fabrication of solder bumps. The formation of nanoparticles on the Sn-Ag solder bumps therefore may be one of the major causes of the collapse of the solder bumps during the solder reow shown in Fig.…”