Experimental study of the heat dissipation of battery with a manifold micro-channel heat sink

Numerical Simulation of Manifold Microchannel Heat Sinks for Thermal Management in a Li‐Ion Battery

“…These results suggest that the overall performance of the MMC is better than that of TMC. This finding is in agreement with experimental research [40], which indicates that the numerical model of the Li-ion battery is valid. So, it is necessary to investigate the effect of the inlet flow rate and aspect ratio on the performance of the MMC through the numerical model to contribute to the application of the MMC in thermal management of the Li-ion battery.…”

“…The mass of the Li‐ion battery ( m = 92 g, internal resistance of battery R 0 = 0.061 Ω) was measured and then the battery was placed in the adiabatic environment. By building an experimental platform 40, the surface temperature of the battery was recorded over time under different discharge currents to obtain the curves of T‐t (temperature‐time) and the d T /d t (rate of temperature change over time). The fitted curves of with discharge current I are displayed in Fig.…”

“…Water was the working fluid. The inlet boundary conditions were defined as velocity-inlet at the inlet which can be determined by the inlet flow rate (20,40,60,80, and 100 mL min -1 ), and the initial fluid temperature was 26.85°C. Pressure-outlet boundary conditions were set for the outlet.…”

Macroscopic negative differential thermal resistance in the overlapping graphene homojunction structure

“…Also, with the integration and miniaturization of electronic devices, heat dissipation has become one of the biggest bottlenecks restricting the development of microelectronics industry. 8 , 9 , 10 It is of great importance to solve the problem of heat dissipation and realize the control of heat flow. Based on this idea, in the 21st century, thermal functional devices have entered a new era of rapid growth and extensive development, with new concepts such as thermal diodes, 11 , 12 thermal transistors, 13 , 14 , 15 thermal logic gates, 16 , 17 and thermal memory 18 , 19 springing up.…”

Numerical investigation of different nozzle-jet distributions based on chessboard high-topology composite heat sink

“…设置多个出入口以缩短单根微通道的 流程 [11] 、改善微通道的拓扑结构 [12] 都是提高微通道 换热效率和均匀性的发展方向. 为了进一步提高热沉 的温度分布的均匀性, 一些研究中 [13,14] 采用插指形平 行通道在微通道上方布置歧管结构进行流量分配, 这 类歧管结构虽然不参与热交换过程, 但实现了微通道 内流动的分割和重新组织, 大幅缩短了流动路径, 从 而改善了热沉的换热系数和温度均匀性 [15] . 在插指形 歧管出入口的设计改进下, 提高热沉的流动换热性能 特别是温度和流动的均匀性能够得到大幅提升, Luo 等人 [13] 发现出入口H型和U型布置的插指形歧管方案 温升最低且流动分配更加均匀, 温度的不均匀度仅为 0.471 K; Xia等人 [16] 对插指形歧管出入口的几何设计 进行了研究, 证明沿流程渐扩形态的入口和渐缩形态 的出口设计可以加强歧管微通道的热传递, 并使流动 分配更加均匀.…”