Experimental study of surface performance of monocrystalline 6H-SiC substrates in plane grinding with a metal-bonded diamond wheel

Pan, Jisheng; Zhang, Xiaowei; Yan, Qiusheng; Chen, Shenkai

doi:10.1007/s00170-016-9095-1

Cited by 18 publications

(5 citation statements)

References 14 publications

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“…In the high-precision grinding process, there are two movements: the rotation of the grinding-wheel and the translational movement of the machining workpiece [20,21]. In Fig.…”

Section: Grinding Kinematicsmentioning

confidence: 99%

A Novel Approach for Surface Topography Simulation Considering the Elastic-Plastic Deformation of a Material During a High-precision Grinding Process

Chen

Jin

2022

Proceeding of 2021 International Conference on Wireless Communications, Networking and Applications

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A novel simulation approach for 3D surface topography that considers the elastic-plastic deformation of workpiece material during a high-precision grinding process is presented in this paper. First, according to the kinematics analysis for the abrasive grain during the grinding process, the motion trajectory of the abrasive grain can be calculated. Second, the kinematic interaction between the workpiece and the abrasive grains can be established, which integrates the elastic-plastic deformation effect on the workpiece material with the topography, the simulation results are more realistic, and the simulation precision is much higher. Finally, based on an improved surface applied to the grinding wheel, the surface topography of the workpiece is formed by continuously iterating overall motion trajectories from all active abrasive-grains in the process of high-precision grinding. Both the surface topography and the simulated roughness value of this work are found to agree well with those obtained in the experiment. Based on the novel simulation method in this paper, a brand-new approach to predict the quality of the grinding surface by providing machining parameters, selecting effective machining parameters, and further optimizing parameters for the actual plane grinding process, is provided.

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“…In the high-precision grinding process, there are two movements: the rotation of the grinding-wheel and the translational movement of the machining workpiece [20,21]. In Fig.…”

Section: Grinding Kinematicsmentioning

confidence: 99%

A Novel Approach for Surface Topography Simulation Considering the Elastic-Plastic Deformation of a Material During a High-precision Grinding Process

Chen

Jin

2022

Proceeding of 2021 International Conference on Wireless Communications, Networking and Applications

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“…Due to the advantages in dealing with the micro-scale problems, the nonlinear deformation and the failure problems, DEM is widely used in the simulation of the machining process of brittle materials [30,36,92,105]. The processing of brittle materials such as ceramic, rock and glass are generally processed in precision and ultra-precision, especially in grinding [106][107][108][109] and polishing [110][111][112]. In addition to traditional machining methods such as cutting, milling and grinding, there are also some emerging auxiliary machining methods, such as: abrasive water-jet machining [113,114], laser-assisted machining [13,92,106,108,[115][116][117][118][119][120][121], ultrasonic machining [122][123][124][125][126][127][128], electron beam machining [129][130][131][132][133], chemical machining [112,134], electro-chemical machining [134] and so on.…”

Section: Machining Simulationmentioning

confidence: 99%

Discrete element modeling of the machining processes of brittle materials: recent development and future prospective

Jiang

Tang

et al. 2020

Int J Adv Manuf Technol

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In recent years, the discrete element method (DEM) has been used to model the bulk material, especially for the brittle materials (such as rocks, ceramics, concrete, ice, etc.) with various mechanical properties or responses by setting serials of contact properties (such as bonds) in the particle assembly. These bonds can withstand a certain amount of force and/or moment, so that the stresses executed in the bond can be used for determining the initiation and propagation of micro-crack. There are increasing evidences over the last twenty years that the DEM is becoming an effective numerical method to simulate the cracking, crushing and deformation of continuous media under external loads. The DEM has now been widely used in the field of processing and machining of rock, ceramic, concrete and other brittle materials. In this paper, the theoretical principles, formulations, contact models as well as the numerical solving processes of DEM are introduced. The applications of DEM for the machining processes of brittle and rigid materials such as ceramics are described and reviewed in detail, with future development trend also discussed.

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“…State-of-the-art SiC wafers are pre-processed via several cycles of lapping or mechanical diamond polishing followed by Chemical Mechanical Polishing (CMP) [2], processes which entails many steps and high machining costs due to the associated slow material removal rate [3]. To enable a reduction of consumable costs, grinding with a consolidated diamond abrasive technology has been investigated as an alternative to lapping and diamond polish over the last years [4][5]. Thus, modern ultra-fine grinding wheel technologies have achieved sub-nm surface roughness (Ra) and sub-µm Total Thickness Variation (TTV) values despite the well-known hardness, stiffness and strength of monocrystalline SiC [6][7].…”

Section: Introductionmentioning

confidence: 99%

Novel Vitrified-Bond Ultra-Fine Grinding Technology for SiC Polishing

Ruiz¹,

Sileno²

2022

MSF

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The present paper shows a new fixed abrasive bond-grit formulation aimed for best-in-class, low-cost and high-quality finished SiC wafer surfaces. Grinding wheels manufactured with this technology can accomplish ultra-smooth SiC (Ra = 0.55 nm and TTV < 1 μm) surfaces due to their unique bonding structure and their tailored grit size. Additionally, SiC wafers ground with these wheels exhibit reduced sub-surface crystal damage, mirror-like polished surface and improved wafer geometry while both the grinding forces and the wheel wear are kept low.

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Experimental study of surface performance of monocrystalline 6H-SiC substrates in plane grinding with a metal-bonded diamond wheel

Cited by 18 publications

References 14 publications

A Novel Approach for Surface Topography Simulation Considering the Elastic-Plastic Deformation of a Material During a High-precision Grinding Process

A Novel Approach for Surface Topography Simulation Considering the Elastic-Plastic Deformation of a Material During a High-precision Grinding Process

Discrete element modeling of the machining processes of brittle materials: recent development and future prospective

Novel Vitrified-Bond Ultra-Fine Grinding Technology for SiC Polishing

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