Experimental Study of Enhanced Boiling Heat Transfer with Suction

Liu, Wanbo; Liu, Bin; Yu, Xintong; Wei, Jinjia

doi:10.1007/s12217-021-09880-w

Cited by 2 publications

(1 citation statement)

References 34 publications

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“…The method has therefore attracted more attention from the research community to fully understand its underlying mechanisms. A representative published work is the study carried out by the authors Zhang et al [57], in which a smooth silicon chip was immersed in the subcooled FC-72 coolant to infer the nucleate pool boiling heat transfer behavior. The authors developed an apparatus incorporating a suction tube with different inner diameters of 2.2, 5.5, and 9.6 mm and tested the distances from the tube inlet to the chip heating surface of 1, 3, and 5 mm.…”

Section: Suctionmentioning

confidence: 99%

An Overview of the Recent Advances in Pool Boiling Enhancement Materials, Structrure, and Devices

Pereira,

Souza,

Lima

et al. 2024

Micromachines

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This review attempts to provide a comprehensive assessment of recent methodologies, structures, and devices for pool boiling heat transfer enhancement. Several enhancement approaches relating to the underlying fluid route and the capability to eliminate incipient boiling hysteresis, augment the nucleate boiling heat transfer coefficient, and improve the critical heat flux are assessed. Hence, this study addresses the most relevant issues related to active and passive enhancement techniques and compound enhancement schemes. Passive heat transfer enhancement techniques encompass multiscale surface modification of the heating surface, such as modification with nanoparticles, tunnels, grooves, porous coatings, and enhanced nanostructured surfaces. Also, there are already studies on the employment of a wide range of passive enhancement techniques, like displaced enhancement, swirl flow aids, and bi-thermally conductive surfaces. Moreover, the combined usage of two or more enhancement techniques, commonly known as compound enhancement approaches, is also addressed in this survey. Additionally, the present work highlights the existing scarcity of sufficiently large available databases for a given enhancement methodology regarding the influencing factors derived from the implementation of innovative thermal management systems for temperature-sensitive electronic and power devices, for instance, material, morphology, relative positioning and orientation of the boiling surface, and nucleate boiling heat transfer enhancement pattern and scale. Such scarcity means the available findings are not totally accurate and suitable for the design and implementation of new thermal management systems. The analysis of more than 100 studies in this field shows that all such improvement methodologies aim to enhance the nucleate boiling heat transfer parameters of the critical heat flux and nucleate heat transfer coefficient in pool boiling scenarios. Finally, diverse challenges and prospects for further studies are also pointed out, aimed at developing important in-depth knowledge of the underlying enhancement mechanisms of such techniques.

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Section: Suctionmentioning

confidence: 99%