Experimental study and modelling of high aspect ratio through silicon vias (TSVs)
Wiebke Schöttler,
Matthias Meyer,
Alejandro Avellan
Abstract:As the semiconductor industry moves forward towards advanced packaging, through silicon vias (TSVs) with a top Critical Dimension (CD) down to 1 µm and aspect ratio 1:15 or higher are being projected. This poses a major challenge to optical metrology as the dimensions of the lattice get close to the wavelength of the visible light. White-light interferometry is commonly used to measure the depth of the vias, but suffers from decreasing signal-to-noise ratio depending on aspect ratio and diameter. To understand… Show more
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