Experimental studies on matching performance of grinding and vibration parameters in ultrasonic assisted grinding of SiC ceramics

Abstract

Ultrasonic assisted grinding (UAG) is an outstanding technology suitable to machine advanced ceramics. During UAG, the effect of ultrasonic vibration on grinding process is mainly determined by matching performance between grinding and vibration parameters in theory. However, this problem is still lack of deep study. With an objective to study the matching performance deeply, conventional grinding (CG) and UAG tests were conducted. The effects of grinding parameters on grinding force, ground surface profile wave, and ground surface roughness between UAG and CG were studied. The results showed that the grinding force, ground surface profile wave height, and ground surface roughness during UAG were reduced in varying degrees compared to CG. Additionally, the reduction percentage that means the effect of ultrasonic vibration on grinding process decreased significantly with increasing grinding speed while affected slightly by increasing of feedrate and grinding depth. To deeply analyze this variety law of the ultrasonic vibration effect during UAG, a matching performance equation referred to grinding wheel diameter, grinding, and vibration parameters is proposed. When the grinding speed increases from 1.26 to 31.5 m/s for feedrate of 100 mm/min and grinding depth of 5 μm, reduction percentage in grinding force for UAG compared to CG (K F ) decreases from about 20 to 4 % and in ground surface roughness (K R ) decreases from 35 to 4 %. With regard to the average difference height (Δh) between the UAG and CG profile waves, it decreases from 2.77 μm almost to zero.

A High-Tolerance Matching Method Against Load Fluctuation for Ultrasonic Transducers

“…Thus, is adopted as an optimum value in the solution of the proposed model. Substituting into (9) and (10), the optimal values of matching inductor and capacitor can be respectively calculated by:…”

“…VER the past decades, power ultrasound has been widely used in industry [1], in ultrasonic welding [2,3], ultrasonic motor [4,5], ultrasonic cleaning [6], and ultrasonic manufacturing [7][8][9][10], etc. As a key component of ultrasonic systems, an ultrasonic piezoelectric transducer (PT) connects driving power supply and load, transfers the electrical energy into a high-frequency vibration, and then transfers it to the other vibration systems [11].…”

A Novel Fast Resonance Frequency Tracking Method Based on the Admittance Circle for Ultrasonic Transducers

“…IEZOELECTRIC transducers (PT) are widely used as the actuators to generate ultrasound for various purposes [1][2][3], such as machining semiconductor materials [4], biological tissue cutting [5] and ultrasonic welding [6][7][8]. When driving a PT, it is important that the PT should be excited at its mechanical resonance frequency , as the highest power conversion is achieved at this frequency [9].…”

Development of electrical enhanced photocatalysis polishing slurry for silicon carbide wafer

“…Ultrasonic-assisted grinding is employed to increase the material removal rate ( MRR ) and improve the surface roughness. 10 Besides, other smoothing methods, such as hydrogen etching, 11 magnetorheological polishing, 12,13 plasma-assisted polishing, 14,15 electron discharge machining, 16 are investigated to polish silicon carbide wafer. Although these methods have been applied in laboratory, people tend to develop chemical mechanical polishing to achieve the atomic smoothing of silicon carbide surface, since the chemical mechanical polishing is widely used to produce super smooth and low damage surface in the semiconductor wafer fabrication process.…”