Experimental Strategies for Studying Tribo-Electrochemical Aspects of Chemical–Mechanical Planarization
Kassapa Gamagedara,
Dipankar Roy
Abstract:Chemical–mechanical planarization (CMP) is used to smoothen the topographies of a rough surface by combining several functions of tribology (friction, lubrication), chemistry, and electrochemistry (corrosion, wear, tribo-corrosion). The surface layer of interest is structurally weakened by the chemical and/or electrochemical reactions of selected additives in a polishing slurry, and the modified surface is flattened by the abrasion of a polishing pad with or without abrasive particles. The chemically active CM… Show more
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