Abstract:Abstract. Due to the rapid growth of high performance electronics devices accompanied by overheating problem, heat dissipater nanocomposites material having ultra-high thermal conductivity and low coefficient of thermal expansion was proposed. In this work, a nanocomposite material made of copper (Cu) reinforced by multi-walled carbon nanotubes (CNTs) up to 10 vol. % was prepared and their thermal behaviour was measured experimentally and evaluated using numerical simulation. In order to numerically predict th… Show more
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