Experimental method and FE simulation model for evaluation of wafer probing parameters

Liu, D.S.; Shih, Meng-Kai

doi:10.1016/j.mejo.2006.03.001

Cited by 22 publications

(7 citation statements)

References 5 publications

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“…In this study, an experiment using single probe test [6] was run to determine the stress distribution of die in probe test. A single-needle pins on die pad in an actual wafer level test.…”

Section: Probe Test Experimental Setupmentioning

confidence: 99%

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Thin wafer probe breaking strength testing using microforce tester

Liu

Chang

Lee

et al. 2010

2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference

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A probe needle card is conventionally used in wafer-level test to check defects in Integrated Circuit. A stable contact resistance must achieve when each probe contacting with bonding pad. Mechanical contact using excessive probe force will cause over sizing scrubbing mark that may lead to damage of die pad as well as breaking of silicon chip for thin wafer. This damage of thin wafer can adversely influence the quality of the following assembly process and more costs by reducing bond and assembly yield. To support probe shape design and realize the relationship between the testing condition and the thin wafer strength, specialized experimental methods and tools must be developed to carry out thin wafer breaking strain/stress. In this paper, newly developed Three-Point-Bending test were set up and carried out to measure the force-displacement relation of various wafer thickness (100 Pm -25Pm) . The results from the testing then coupled with finite element analysis to reverse finding the breaking stress/strain as a function of wafer thickness. The result, from this research can support the engineer to design better probe geometry shape and choose wafer testing conditions.

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“…In this study, an experiment using single probe test [6] was run to determine the stress distribution of die in probe test. A single-needle pins on die pad in an actual wafer level test.…”

Section: Probe Test Experimental Setupmentioning

confidence: 99%

“…They has point out the single-needle probe test results indicate that the contact force and scrub length increased when the overdrive increased. [6] This study are split into two components. One set of investigates an approach for the characterization of silicon die failure strength, employing a simple three-point bending test technique.…”

Section: Introductionmentioning

confidence: 99%

Thin wafer probe breaking strength testing using microforce tester

Liu

Chang

Lee

et al. 2010

2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference

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“…Several literatures (Bates, 1997;Comeau and Naduau, 1991;Chao et al, 2003;Liu and Shih, 2006) revealed that the contact force sensitivity is a function of the dimensions of probing needle, but none of them studied the effect of the geometric changes on the contact force and the forward displacement systematically. In this study, a finite element model of a cantilever needle was first constructed to simulate the stress distribution and the needle tip displacement during probing.…”

Section: Fig 1 -Epoxy Ring Probe Card For DVI Probing Test (Providedmentioning

confidence: 99%

“…Langlois et al (2003) focused their research on the probe card alignment technology to support the increasingly thorough testing and fast product cycle. Liu and Shih (2006) have set a single tungsten needle probe making contact with an Al pad was employed to investigate the relationships between the overdrive, contact force and scrub mark length. A 3-D FE model was also developed for analyzing the contact phenomena during wafer testing.…”

Section: Introductionmentioning

confidence: 99%

Geometric parameter design of a cantilever probing needle used in epoxy ring probe card

Chang

2009

Journal of Materials Processing Technology

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“…In the literature, usually the authors analyze the bond pad failure with static modeling, results might be correlated with experimental results [5,6]. Some studies point out the dynamic deformation of contact phenomenon with explicit finite elements analysis and investigate the scrub mark on the die [7,8]. The reaction force and dynamic behavior of needle is simulated by Schmadlak and al., they observe dynamic effects during the first 100µs after the impact time but its magnitude remains low [9].…”

Section: Probing Simulationmentioning

confidence: 99%

Study of Probing Test for Electrical Wafer Sort Application: Dynamical Simulation and Experimental Measurement

Cacho

Vettori²,

Thiery³

et al. 2007

2007 9th Electronics Packaging Technology Conference

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Electrical Wafer Sort process is known to induce stress in the pad structure and can lead to yield loss. In the present paper, probing simulation with Finite Element Method is performed and faced to experimental measurements. Firstly, the contact surface for planar and non-planar impacts and the needle structural lateral reaction force studies are carried out with static simulation. Then, using explicit solver, a calibration of the vertical and lateral reaction forces is performed for different over travel distances and needle geometries. Dynamical results of simulation are in good agreement with experimental measurements. The analysis shows that inertial effects during probing process remain limited. In addition to that, the measured force features are well reproduced by modeling, particularly the fine effects observed during the unloading stage. Finally, the effect of aluminium mechanical behavior is discussed by introducing permanent deformation ability of the pad.

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Experimental method and FE simulation model for evaluation of wafer probing parameters

Cited by 22 publications

References 5 publications

Thin wafer probe breaking strength testing using microforce tester

Thin wafer probe breaking strength testing using microforce tester

Geometric parameter design of a cantilever probing needle used in epoxy ring probe card

Study of Probing Test for Electrical Wafer Sort Application: Dynamical Simulation and Experimental Measurement

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