Experimental Investigation on the Thermal Performance of a Heat Pipe-based Cooling System

Driss, Ameni; Maalej, Samah; Chouat, Isra; Zaghdoudi, Mohamed Chaker

doi:10.18280/mmep.060209

Cited by 4 publications

(5 citation statements)

References 6 publications

(8 reference statements)

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“…The rest of its length constitutes the 'adiabatic zone'. When designing a thermosyphon heat pipe, one of the fundamental parameters for its thermal dimensioning is the socalled equivalent thermal resistance [11], defined as follows:…”

Section: Definition Of the Thermal Model Of The Thermosyphon Heat Pipementioning

confidence: 99%

Model Development of a Thermosyphon Heat Pipe for the Temperature Management in a Wine Fermenter Tank

Malavasi¹,

Cattani²,

Bozzoli³

et al. 2022

MMEP

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The grape must temperature management in a fermenter tank is fundamental to guaranty a high-quality wine. The fermentation is an exothermic process and a good cooling system in fermenter tanks is required. However, for reducing costs and increasing the efficiency of the cooling operation, a passive device based on the heat pipe technology was proposed. Since its thermal sizing must necessarily be accurate to allow a correct temperature of the product during fermentation, in this paper a thermal model of the proposed device was proposed and experimentally validated.

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Section: Definition Of the Thermal Model Of The Thermosyphon Heat Pipementioning

confidence: 99%

Model Development of a Thermosyphon Heat Pipe for the Temperature Management in a Wine Fermenter Tank

Malavasi¹,

Cattani²,

Bozzoli³

et al. 2022

MMEP

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“…The heat transfer coefficients of evaporation and condensation can be determined by the following correlation [34] 𝑁𝑢 = A Re 𝑚 1 Pr 𝑚 2 Ja* 𝑚 3 𝐾 𝑝 𝑚 4 (31) In Eq. ( 31), the dimensionless numbers are defined as follows (i) the Reynolds number 𝑅𝑒 = 𝑄 𝜇 𝑛𝑓 𝜋 D 𝑜 𝛥ℎ 𝑣 (32) where Q is the heat flux rate.…”

Section: Modeling Of the Heat Transfermentioning

confidence: 99%

“…(iii) the Nusselt number 𝑁𝑢 = ℎ 𝐿 𝜆 𝑛𝑓 (34) h is the heat transfer coefficient in the evaporator or condenser section, and L is a reference length which is expressed as For evaporation…”

Section: Modeling Of the Heat Transfermentioning

confidence: 99%

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Investigation of the Thermal Performance of a Nanofluid-filled Grooved Cylindrical Heat Pipe for Electronics Cooling

Saad

Maalej

Zaghdoudi

2022

ARFMTS

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Thermal management of electric and electronic components is a critical issue and needs to consider enhanced cooling systems such as heat pipes. This study deals with the theoretical modeling of a nanofluid-filled copper cylindrical heat pipe for electronics cooling applications. The heat pipe includes helicoidal and trapezoidal capillary grooves. The model can predict the capillary limit as well as the heat transfer in the different sections of the heat pipe. The thermal resistances of the evaporation and condensation sections are calculated based on correlations for heat transfer, which are determined from experiments. Two working nanofluids are considered: water/CuO and water/Al2O3. The thermal performances are predicted for different concentrations and heat sink temperatures, and the heat pipe is positioned horizontally. For both nanofluids, the results indicate that augmenting the concentration of the nanoparticles leads to a capillary limit increase reaching up to 14 % and 25 % for water/Al2O3 and water/CuO, respectively, and an overall thermal resistance decrease reaching up to 51 % and 68 % for water/Al2O3 and water/CuO. Moreover, decreases up to 24 %, and up to 18 % in the evaporator wall temperatures are obtained for water/CuO and water/Al2O3 nanofluids, respectively. The nanofluid water/CuO gives the best thermal performance whatever the nanoparticle concentration and heat sink temperature.

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“…Micro channels are smaller, have less coolant inventory, and have a bigger heat transfer surface, making them useful in automotive, aerospace, refrigeration, air conditioning, gas turbine blade cooling, and processing [13][14][15][16]. They have low channel pressure drop and strong convective heat transfer coefficient [17,18]. Although pressure drop was high, Tuckerman and Pease [19] used direct water circulation in rectangular micro channels to reduce heat flux up to 790 W/cm 2 utilizing silicon microchannels for electronics cooling in 1981.…”

Section: Introductionmentioning

confidence: 99%

Enhancing Radiator Cooling with CuO Nanofluid Microchannels

Akhai,

Wadhwa

2024

International Journal of Automotive Science and Technology

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The study explores in employing copper oxide (CuO) nanofluid as a cooling medium in the vehicle radiators. To simulate the heat transfer process, the microchannel is construct-ed using electron discharge machining (EDM) and a computational fluid dynamics (CFD) modeling is employed. UV-visible spectroscopy, scanning electron microscopy (SEM), and dynamic light scattering (DLS) are used to characterize the CuO nanofluid. CuO nanofluid surpasses water in the heat transfer capabilities, with a 40% improvement in thermal conductivity. The average size of CuO nanoparticles was determined via DLS to be 485.1 nm. The heat transfer coefficient of CuO nanofluid is 5366 W/m2K, which is 116% larger than that of water. The increased heat transfer capabilities of CuO nanofluid microchannel flow indicate to its potential as a viable replacement for conventional radiators in the automotive applications. Lower engine temperatures, increased fuel efficiency, and longer engine lifespan may result from improved cooling performance. Due of the small size of microchannels, more efficient and space-saving radiators for automobiles are conceivable. More research is needed to improve the microchannel design as well as to realize the practical benefits of CuO nanofluids in car cooling systems

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Experimental Investigation on the Thermal Performance of a Heat Pipe-based Cooling System

Cited by 4 publications

References 6 publications

Model Development of a Thermosyphon Heat Pipe for the Temperature Management in a Wine Fermenter Tank

Model Development of a Thermosyphon Heat Pipe for the Temperature Management in a Wine Fermenter Tank

Investigation of the Thermal Performance of a Nanofluid-filled Grooved Cylindrical Heat Pipe for Electronics Cooling

Enhancing Radiator Cooling with CuO Nanofluid Microchannels

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