Experimental Investigation of Vapor Chamber Module Applied to High-Power Light-Emitting Diodes

Huang, Hao; Chiang, Yu-Ming; Huang, Chin-Chuan; Chen, S.-L.

doi:10.1080/08916150802530187

Cited by 25 publications

(7 citation statements)

References 5 publications

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“…The thermal spreading resistance of a vapor chamber could be as low as 0.38 K/W from Wang and coworkers [204]. Huang et al [237] applied a lamp-type vapor chamber to high power LED systems in natural convection, and found that thermal spreading resistance was lower than the metal plate by 34% at 30 W. Li et al [238] fabricated a copper-water loop heat pipe (LHP) for LED illumination applications. They found that total thermal resistance ranged from 1.0 to 0.4 K/W (heating loads ranged from 30 W to 300 W).…”

Section: C) Heat Pipe and Vapor Chambermentioning

confidence: 99%

Heat and fluid flow in high-power LED packaging and applications

Luo

Qiu

Liu

et al. 2016

Progress in Energy and Combustion Science

402

121

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Light-emitting diodes (LEDs) are widely used in our daily lives. Both light and heat are generated from LED chips and then transmitted or conducted through multiple packaging materials and interfaces. Part of the transmitted light converts into heat along the light propagation; in return, the accumulation of heat leads to the degradation of light output. The accumulated heat negatively influences the reliability and longevity of LEDs, and thus thermal management is critical for LED packaging and applications. On the other hand, in LED packaging processes, many fluid flow problems exist, such as phosphor coating, silicone injection, chip bonding, solder reflow, etc. Amongst them, phosphor coating is the most important process which is essential for LED performance. Phosphor gel is a kind of non-Newton fluid and its coating process is a typical fluid-flow problem. Overall, since LED packaging and applications present many heat and fluid flow problems, obtaining a full understanding of these problems enables advancements in the development of LED processes and designs. In this review, the emphasis is placed on heat generation in chips, heat flow in packages and application products, fluid flow in phosphor coating process, etc. This is a domain in which significant progress has been achieved in the last decade, and reporting on these advances will facilitate state-of-the-art LED packaging and application technologies.

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Section: C) Heat Pipe and Vapor Chambermentioning

confidence: 99%

Heat and fluid flow in high-power LED packaging and applications

Luo

Qiu

Liu

et al. 2016

Progress in Energy and Combustion Science

402

121

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show abstract

“…Overall, vapor chambers are able to increase the fin efficiency, increase the fin contact area, and decrease the size of the thermal module. Huang et al [10] experimentally investigated the thermal performance of the vapor chamber module applied to the highpower LEDs in natural convection. The flat-plate type vapor chamber and the lamptype vapor chamber were provided to solve the heat dissipation problem of the highpower LEDs.…”

Section: Introductionmentioning

confidence: 99%

The Effects of Vapor Space Height on the Vapor Chamber Performance

Huang

Lee³

2012

Experimental Heat Transfer

Self Cite

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The performance of vapor chambers, also known as flat heat pipes, was studied experimentally. Five vapor chambers with different vapor space heights were intentionally fabricated and tested. The hydraulic diameter ratio was created to be the dimensionless parameter to represent the variation of the vapor space height. The parameter was further used to derive the optimum vapor chamber height. It was found that the vapor chamber achieved the optimum design when the hydraulic diameter ratio of non wick vapor space to chamber interior was greater than 0.6. It is believed that the results are valuable for future vapor chamber design.

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“…Another two-phase heat transfer device noted flat heat pipe or vapor chamber has applied in many areas including server, LEDs, insert molding etc. [10][11][12][13][14][15][16]. Since the Sapphire Atomic HD 3870 of VGA module for AMD RV 670 XT using vapor chamber has a very profitable thermal performance than AMD reference dual slot thermal module in Taiwan, there are more and more manufactures employing vapor chamber in VGA thermal modules.…”

Section: Introductionmentioning

confidence: 99%

3-D numerical and experimental models for flat and embedded heat pipes applied in high-end VGA card cooling system

Wang

2012

International Communications in Heat and Mass Transfer

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Experimental Investigation of Vapor Chamber Module Applied to High-Power Light-Emitting Diodes

Cited by 25 publications

References 5 publications

Heat and fluid flow in high-power LED packaging and applications

Heat and fluid flow in high-power LED packaging and applications

The Effects of Vapor Space Height on the Vapor Chamber Performance

3-D numerical and experimental models for flat and embedded heat pipes applied in high-end VGA card cooling system

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