Experimental investigation of transparent silicon carbide for atom chips

Huet, Landry; Ammar, Mahdi; Morvan, E.; Sarazin, N.; Pocholle, Jean‐Paul; Reichel, Jakob; Guerlin, Christine; Schwartz, Sylvain

doi:10.1063/1.3689777

Cited by 14 publications

(13 citation statements)

References 21 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Figure 1 depicts a 'like-for-like' graphical comparison of the optical setup in a standard 6-beam MOT ( Fig. 1(a) [2,16,17]), a mirror MOT ( Fig. 1(b) [18,19]) and a grating MOT (GMOT, Fig.…”

Section: Introductionmentioning

confidence: 99%

Phase-space properties of magneto-optical traps utilising micro-fabricated gratings

McGilligan¹,

Griffin²,

Riis³

et al. 2015

Opt. Express

View full text Add to dashboard Cite

We have used diffraction gratings to simplify the fabrication, and dramatically increase the atomic collection efficiency, of magneto-optical traps using micro-fabricated optics. The atom number enhancement was mainly due to the increased beam capture volume, afforded by the large area (4cm(2)) shallow etch (~ 200nm) binary grating chips. Here we provide a detailed theoretical and experimental investigation of the on-chip magneto-optical trap temperature and density in four different chip geometries using (87)Rb, whilst studying effects due to MOT radiation pressure imbalance. With optimal initial MOTs on two of the chips we obtain both large atom number (2×10(7)) and sub-Doppler temperatures (50 μK) after optical molasses.

show abstract

Section: Introductionmentioning

confidence: 99%

Phase-space properties of magneto-optical traps utilising micro-fabricated gratings

McGilligan¹,

Griffin²,

Riis³

et al. 2015

Opt. Express

View full text Add to dashboard Cite

show abstract

“…In this paper we show -for the first time -how inductive ring traps can be obtained using RF-dressing, which then permits access to the ≤ 0.3 mm ring radius regime, suitable for fabrication on atom chips. Such chips offer the prospect of portable ultracold atomic setups and there have been recent important developments in both chip loading [10] and their application [11,12]. We envisage prospects for low-decoherence on-chip studies of Sagnac interferometry, superfluidity, ring dark solitons [13] as well as vortices [14] and solitons [15] in low-dimensional systems.…”

Section: Introductionmentioning

confidence: 99%

Inductive dressed ring traps for ultracold atoms

Vangeleyn¹,

Garraway²,

Perrin³

et al. 2014

J. Phys. B: At. Mol. Opt. Phys.

View full text Add to dashboard Cite

Abstract.We present two novel dressed inductive ring trap geometries, ideal for atom interferometry or studies of superfluidity and well-suited to utilisation in atom chip architectures. The design permits ring radii currently only accessible via near-diffraction-limited optical traps, whilst retaining the ultra-smooth magnetic potential afforded by inductive traps. One geometry offers simple parallel implementation of multiple rings, whereas the other geometry permits axial beamsplitting of the torus suitable for whole-ring atom interferometry.

show abstract

“…Huet et al investigated some properties of the transparent atom chip made of silicon carbide (SiC) and gold wires [17]. Their results show that a better thermal behavior is observed in the presence of electrical current, twice as good as for a silicon substrate, which makes the single crystal SiC a candidate substrate for atom chip applications.…”

Section: Introductionmentioning

confidence: 99%

The Design, Fabrication and Characterization of a Transparent Atom Chip

Chuang

Huang

Chen

et al. 2014

Sensors

View full text Add to dashboard Cite

This study describes the design and fabrication of transparent atom chips for atomic physics experiments. A fabrication process was developed to define the wire patterns on a transparent glass substrate to create the desired magnetic field for atom trapping experiments. An area on the chip was reserved for the optical access, so that the laser light can penetrate directly through the glass substrate for the laser cooling process. Furthermore, since the thermal conductivity of the glass substrate is poorer than other common materials for atom chip substrate, for example silicon, silicon carbide, aluminum nitride. Thus, heat dissipation copper blocks are designed on the front and back of the glass substrate to improve the electrical current conduction. The testing results showed that a maximum burnout current of 2 A was measured from the wire pattern (with a width of 100 μm and a height of 20 μm) without any heat dissipation design and it can increase to 2.5 A with a heat dissipation design on the front side of the atom chips. Therefore, heat dissipation copper blocks were designed and fabricated on the back of the glass substrate just under the wire patterns which increases the maximum burnout current to 4.5 A. Moreover, a maximum burnout current of 6 A was achieved when the entire backside glass substrate was recessed and a thicker copper block was electroplated, which meets most requirements of atomic physics experiments.

show abstract

Experimental investigation of transparent silicon carbide for atom chips

Cited by 14 publications

References 21 publications

Phase-space properties of magneto-optical traps utilising micro-fabricated gratings

Phase-space properties of magneto-optical traps utilising micro-fabricated gratings

Inductive dressed ring traps for ultracold atoms

The Design, Fabrication and Characterization of a Transparent Atom Chip

Contact Info

Product

Resources

About