Experimental investigation of surface topography in photochemical machining of Inconel 718

Misal, Nitin D.; Saraf, Atul R.; Sadaiah, Mudigonda

doi:10.1080/10426914.2017.1317786

Cited by 22 publications

(9 citation statements)

References 20 publications

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“…Regression equations for above response parameter are shown as A regression equation for MRR, U C , EF and R a is shown in Eqs. (4)- (7). An excellent agreement is observed between the values predicted by regression and obtained by experiments.…”

Section: The Equation Showing the Relationship Between The Etchant Cosupporting

confidence: 81%

“…Cakir [4] has performed the PCM of aluminum with ferric chloride as etchant and investigated the effect of etchant on surface quality and depth of cut. The chemical etching of copper, brass and Inconel 718 is reported with ferric chloride and cupric chloride as etchant, and effect of etchant and machining condition on the depth of etch and surface roughness is investigated [5][6][7]. Recently, PCM is used in micro-engineering, micro-fluidics and biotechnology.…”

Section: Introductionmentioning

confidence: 99%

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Effect and optimization of photochemical machining process parameters for manufacturing array of micro-hole

Agrawal

Kamble

2019

J Braz. Soc. Mech. Sci. Eng.

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The stainless steel-304 is used in various surgical instruments due to its low carbon content and better corrosion resistance. SS-304 is machined using photochemical machining process (PCM) to obtain the components with micro-dimensions. The statistical methods of signal-to-noise (S/N) ratio and the analysis of variance (ANOVA) are applied to investigate effect of concentration of etchant, time of etching and temperature of etchant using DoE (L 27) orthogonal array. The performance characteristics like material removal rate (MRR), surface roughness (R a), undercut (U C) and etch factor (EF) are optimized during the investigation. The ANOVA technique is used to evaluate significance and percentage contribution of each parameter. The regression model for PCM of SS-304 is developed. The ANN technique is used to compare the predicted and experimental results of machining. The MRR, R a , EF and U C are showing improvement of 0.38 mm 3 /min, 1.271 µm, 0.11 and 0.028 mm, respectively, after the confirmatory test. The developed model is used to manufacture the array of micro-holes (5 × 5) with hole size of 220 µm, 280 µm and 370 µm which are used for metering of medicine in biomedical applications.

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Section: The Equation Showing the Relationship Between The Etchant Cosupporting

confidence: 81%

Section: Introductionmentioning

confidence: 99%

Effect and optimization of photochemical machining process parameters for manufacturing array of micro-hole

Agrawal

Kamble

2019

J Braz. Soc. Mech. Sci. Eng.

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“…[3][4][5][6]. The photochemical machining study for the hard to cut materials like Inconel has been also reported [7][8].…”

Section: Related Workmentioning

confidence: 99%

Edge Deviation Analysis for Photochemical Machining of Copper

Vhare¹,

Chavan²,

Shinde³

et al. 2019

International Journal of New Technology and Research

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Photochemical machining is broadly employed in the fabrication of components which are used in various fields like electronics, medical, biological, etc. Copper is one of the materials having various applications. The accuracy of the photochemically machined component is governed by edge deviation and it plays vital role in many small size components. This paper focusses on the edge deviation analysis for photochemically machined copper specimens. The experimentation has been performed for different concentrations for ferric chloride etchant. The analysis of the specimens has been carried out and the suitable parameters are predicted in the paper.

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“…Ferric chloride (FeCl3) is the most commonly used etchant for photochemical machining (PCM) .In an ideal world, to maintain a constant rate of etching and hence control of part dimensions dependent on etch time, the etchant composition would be constant [4]. Unfortunately, in the real world, the etchant composition changes continuously.…”

Section: Processmentioning

confidence: 99%

Etching Depthvariation of Brass Material for Different Operating Conditions

Saurabh¹,

Onkar²,

Kamesh³

et al. 2019

International Journal of New Technology and Research

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The conventional machining deals with the removal of metal by direct contact between the tool and the work piece, which results into the formation of chips, debris etc. So, there is scope for unconventional machining process like PCM. This paper focuses on study of Depth of etching in photochemical machining by varying temperature and time of etching. The objective is to study the effect of these parameters and find relation between them. This process is the bridge between 2D and 3D manufacturing processes. Initially the photo-tools are prepared; Brass material was taken for experimentation. The control parameters were temperature, concentration and time. The concentration of etchant (FeCl 3) was 781 grams per liter. The temperature and time are varying parameters for etching. The readings are taken by Digital Micro-meter. A pattern may be transferred onto a photoresist film by exposing the photoresist to light through a mask of the pattern called photo-tool and obtain pattern on metal.

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Experimental investigation of surface topography in photochemical machining of Inconel 718

Cited by 22 publications

References 20 publications

Effect and optimization of photochemical machining process parameters for manufacturing array of micro-hole

Effect and optimization of photochemical machining process parameters for manufacturing array of micro-hole

Edge Deviation Analysis for Photochemical Machining of Copper

Etching Depthvariation of Brass Material for Different Operating Conditions

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