Experimental investigation of substrate board orientation effect on the optimal distribution of IC chips under forced convection

Numerical investigation on the electronic components' cooling for different coolants by finite element method

“…A revolutionary change in microchip and nanoscale CPUs is being used at a commercial level in recent decades, and these microchips can achieve a high clock speed, as they possess a large number of ICs and transistors. Although processing speed and computational power usage is rising, the technology is continually scaled down, allowing integrated circuits to operate faster 1,2 . Therefore, the quick extraction of a huge amount of heat from microprocessors and other microchips is a matter of great concern these days.…”

“…Kurnia et al 3 considered squared cross‐sectioned cooling channels of various designs and compared their relative advantages and restrictions in terms of heat transfer per unit pumping power. Investigations of heat transfer characteristics with various heat sink configurations have been carried out both theoretically and practically in microchannels and minichannels, respectively, by Al‐Neama et al 14 and Ghasemi et al 5 Mathew and Hotta 1 employed a hybrid optimization technique to discover an optimum arrangement of IC chips on the substrate board and found that the size and position of the chips strongly dictate the heat transfer characteristics. Later, a detailed analysis of the thermal and flow characteristics inside a microchannel heat sink for a lithium‐ion battery has been performed by Bayrak et al, 15 implementing different geometric modifications.…”

“…However, the modeling of the electronic component cooling system has extensive literature. For a comprehensive survey, readers are directed to the detailed review from previous reports 1,2,12 …”

Enhancement of Heat Transfer for Electronic Components in Horizontal Channel by Passive Cooling.(Dept.M)

“…Jassim and Muzychka [15] found that the distribution of heat sources installed on the wall in non-uniformed way can give an optimized model for the distribution of heat transfer by forced convection regardless of the geometric properties with free stream velocity and improve the effectiveness of the processes by reducing the heat sources right after the leading edge. Mathew and Hotta [16] made an experimental study that investigates the orientation of IC chips for the laminar forced convection flow. The aim of the study is to know the optimum configuration for IC chips mounted on the board.…”