Experimental Investigation of IGBT Silicone Gel Removal

Bugingo, Sharhts S.; Freere, Peter; Garde, Kathy; Schalekamp, Henk; Ghimire, Pramod; Schultz, R.D.

doi:10.1109/africon46755.2019.9133966

Cited by 3 publications

(2 citation statements)

References 6 publications

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“…Its adhesive qualities facilitating easy attachment to various surfaces. These impressive mechanical attributes, along with its dielectric internal insulation capabilities, render it well-suited for applications in IGBT packaging [9], [10]. This protective layer needs to be thoroughly examined to understand the moisture buildup within the power modules [4], [11].…”

Section: Introductionmentioning

confidence: 99%

Investigating Humidity Transfer in IGBT Modules: An Integrated Experimental and Simulation Approach

Titova,

Lapke

2024

IEEE Open J. Power Electron.

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This study presents a novel, integrated approach to investigating and characterizing the impact of humidity on Insulated-Gate Bipolar Transistors (IGBTs) within large-scale inverter systems. Combining meticulously designed experimental setups and advanced finite element simulations, we delve deep into the complex dynamics of moisture transfer within IGBT modules. Our research demonstrates a meticulously designed experimental setup within a controlled climate chamber, enabling a comprehensive characterization process of the humidity transfer into the IGBT module. The proposed method allows for a detailed study of the moisture distribution as well as the effect of the temperature on the moisture within an IGBT module. We leverage the advanced capabilities of commercial finite element software to complement our experimental findings. These simulations enable a deeper understanding of the moisture distribution's symmetries and provide invaluable insights into simplifying the complex simulations. By integrating these diverse methodologies, we develop a comprehensive approach that deciphers the spatial distribution of humidity within the module and its real-time responses to environmental conditions. This integrated approach holds an immense potential for analyzing optimal system performance and facilitating self-optimization of the inverter by predicting stress induced by humidity.

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Section: Introductionmentioning

confidence: 99%

Investigating Humidity Transfer in IGBT Modules: An Integrated Experimental and Simulation Approach

Titova,

Lapke

2024

IEEE Open J. Power Electron.

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“…Solder IGBT modules are a common package type that is widely used in industrial and transportation traction applications [4]. The most important feature of this package-type module is that its base is completely insulated, which makes it easy to mount to the heat sink and can significantly reduce the application cost of the module, which is widely used.…”

Section: Introductionmentioning

confidence: 99%

Research Progress in Failure Mechanism and Health State Evaluation Index System of Welded IGBT Power Modules

et al. 2023

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As the performance requirements of insulated gate bipolar transistors (IGBTs) in various fields of power electronic systems are increasing, the IGBT power module package structure, aging mechanism analysis, and selection of health state characteristic parameters are of great significance to ensure the normal operation of power systems. At present, research on the aging failure of welded IGBT modules is relatively comprehensive and can be divided into chip aging failure and package aging failure according to their failure parts. However, there is some research on the relationship between aging failure and the characteristic quantity of power modules, but no definite system has been formed. Therefore, in this paper, the packaging structure of the solder-type IGBT modules and the aging mechanism caused by different aging reasons were summarized. Moreover, the health status monitoring of solder-type IGBT modules from the junction temperature, bonding line, solder layer, and package insulation aging health status monitoring and its quantitative assessment research progress was analyzed in detail. Also, the health state evaluation index system of the solder-type IGBT modules was completed on the basis of voltage, current, thermal, insulation parameters, and other characteristic quantities. Finally, based on the analysis of domestic and international research problems, the development trend and direction of the condition monitoring technology of solder-type IGBT modules is foreseen. The research on condition monitoring for welded IGBT module technology has a certain significance.

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Analysis of Thermal Aging Characteristics of Silicone Gel for High-Voltage IGBT Packaging

Chen

et al. 2023

2023 IEEE 4th International Conference on Electrical Materials and Power Equipment (ICEMPE)

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Experimental Investigation of IGBT Silicone Gel Removal

Cited by 3 publications

References 6 publications

Investigating Humidity Transfer in IGBT Modules: An Integrated Experimental and Simulation Approach

Investigating Humidity Transfer in IGBT Modules: An Integrated Experimental and Simulation Approach

Research Progress in Failure Mechanism and Health State Evaluation Index System of Welded IGBT Power Modules

Analysis of Thermal Aging Characteristics of Silicone Gel for High-Voltage IGBT Packaging

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