2018
DOI: 10.1109/tasc.2018.2801358
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Experimental Investigation of Bi-2223/Ag Superconducting Tape Joints

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Cited by 7 publications
(3 citation statements)
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“…26,27) Although joint samples fabricated by adopting this process for DI-BSCCO tapes 28) showed quite low resistance of ∼10 −12 Ω by forming the superconducting joint, I c across the joint was low, ∼10 A at 4 K in self-field. 29) Such a low joint I c value might be due to the poor J c properties of the Bi2223 polycrystalline bulk at the joint layer, which is typically lower than 1 kA cm −2 at 77 K in the self-field. 30) Our recent studies have clarified the strategies for preparing the Bi2223 polycrystalline materials with high J c characteristics.…”
mentioning
confidence: 99%
“…26,27) Although joint samples fabricated by adopting this process for DI-BSCCO tapes 28) showed quite low resistance of ∼10 −12 Ω by forming the superconducting joint, I c across the joint was low, ∼10 A at 4 K in self-field. 29) Such a low joint I c value might be due to the poor J c properties of the Bi2223 polycrystalline bulk at the joint layer, which is typically lower than 1 kA cm −2 at 77 K in the self-field. 30) Our recent studies have clarified the strategies for preparing the Bi2223 polycrystalline materials with high J c characteristics.…”
mentioning
confidence: 99%
“…This indirect method was applied to DI-BSCCO ® , the practical Bi-2223/Ag tape. Ebara et al [84,85] fabricated a loop sample having one Bi-2223 superconducting joint, with the surface filaments of both ends were exposed by etching the Ag sheath with a knife. After sandwiching precursor powder between the exposed filaments to form a closed-loop shape, heat treatment was performed at 838 • C for 100 h under uniaxial pressure.…”
Section: History Of the Development Of Superconducting Joint Between ...mentioning
confidence: 99%
“…Compared to the development of joints between RE123coated conductors, those between Bi2223 tapes are less advanced. A typical option to form a superconducting joint between Bi2223 tapes is using solid diffusion at the joint boundary in conjunction with the application of compressive pressure [16][17][18][19]. A major problem of this method is a mechanically weak joint interface developed by solid diffusion.…”
Section: Introductionmentioning
confidence: 99%