2015
DOI: 10.1016/j.precisioneng.2015.05.003
|View full text |Cite
|
Sign up to set email alerts
|

Experimental investigation into Ball end Magnetorheological Finishing of silicon

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
21
0

Year Published

2017
2017
2022
2022

Publication Types

Select...
7
3

Relationship

1
9

Authors

Journals

citations
Cited by 62 publications
(21 citation statements)
references
References 25 publications
0
21
0
Order By: Relevance
“…In addition, the types of abrasive particles used in the MR polishing fluid have a significant impact on the polishing performance for different materials. Cerium oxide abrasive particles may be added into the MR polishing fluid to polish a silicon sample or other related silicate glasses [15], whereas SiC or diamond abrasive particles are typically used to polish metal materials [16][17][18] In recent years, several methods of polishing the internal surfaces of cylindrical workpieces using MR polishing have been reported. For example, a magnetorheological abrasive flow finishing (MRAFF) process was developed to polish workpieces with complex internal geometries [19,20].…”
Section: Introductionmentioning
confidence: 99%
“…In addition, the types of abrasive particles used in the MR polishing fluid have a significant impact on the polishing performance for different materials. Cerium oxide abrasive particles may be added into the MR polishing fluid to polish a silicon sample or other related silicate glasses [15], whereas SiC or diamond abrasive particles are typically used to polish metal materials [16][17][18] In recent years, several methods of polishing the internal surfaces of cylindrical workpieces using MR polishing have been reported. For example, a magnetorheological abrasive flow finishing (MRAFF) process was developed to polish workpieces with complex internal geometries [19,20].…”
Section: Introductionmentioning
confidence: 99%
“…Predicted response %ΔRa was calculated and found as 54.69 by regression model at an optimum machining conditions of magnetizing current = 5.7 A, tool rotational speed = 500 rpm and working gap = 0.66 mm. Saraswathamma et al [32] experimentally studied through statistical design of experiments the effect of process parameters such as core rotational speed, working gap, and magnetizing current on a percentage reduction in surface roughness of silicon wafer in BEMRF process. Individual effect on surface roughness values in terms of arithmetical mean roughness (Ra) was studied by applying ANOVA.…”
Section: A Past Investigationsmentioning
confidence: 99%
“…Based on experimental results, cutting force is the dependent variable, while feed, rotational speed, axial depth, radial depth, edge radius, and coating type are independent variables. According to the experiment based on orthogonal design, a predictive model of cutting force can be established in each of the three directions as follows [14].…”
Section: Setup Of Predictive Model For Cutting Forcementioning
confidence: 99%