2020
DOI: 10.1007/s10973-020-09641-8
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Experimental investigation and optimization of loop heat pipe performance with nanofluids

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Cited by 13 publications
(3 citation statements)
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“…5(a) to 5(d). The reduction in the thermal resistance is due to the formation of vapour bubbles at the liquid-solid interface (Harun et al 2019). The lowest thermal resistance is found at lower evacuation pressure 0.0799 bar which is 0.132243 K/W at 90W, 0.116598K/W at 80W, 0.131791K/W at 90W and 0.125142K/W at 60W for 30%, 50%,70% and 90% respectively.…”
Section: Evacuation Effect On Thermal Resistancementioning
confidence: 98%
See 1 more Smart Citation
“…5(a) to 5(d). The reduction in the thermal resistance is due to the formation of vapour bubbles at the liquid-solid interface (Harun et al 2019). The lowest thermal resistance is found at lower evacuation pressure 0.0799 bar which is 0.132243 K/W at 90W, 0.116598K/W at 80W, 0.131791K/W at 90W and 0.125142K/W at 60W for 30%, 50%,70% and 90% respectively.…”
Section: Evacuation Effect On Thermal Resistancementioning
confidence: 98%
“…Whereas some researchers found that a high concentration of nanoparticles improves thermal performance. Harun et al (2019) and Li et al (2020) reported that the heat transfer coefficient and thermal performance of PHP increase as the nanoparticle concentration increases in the nanofluid. Nine et al (2014) investigated the effect of different conc.…”
Section: Introductionmentioning
confidence: 99%
“…The dispersion of materials with high thermal properties enhances the thermal properties of based fluid thus increase the heat transfer performance. Nanofluid had been widely used in heat transfer applications such as heat exchanging systems [1], the cooling system in vehicles [2], and electronic cooling systems [3].…”
Section: Introductionmentioning
confidence: 99%