Experimental color video capturing equipment with three 33-megapixel CMOS image sensors

Yamashita, Takayuki; Huang, Steven; Funatsu, Ryohei; Mansoorian, B.; Mitani, Kohji; Nojiri, Y.

doi:10.1117/12.805493

Cited by 10 publications

(2 citation statements)

References 0 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Therefore, IP is a suitable 3D imaging method for future 3D television systems. In this paper, an integral 3D television system in which an ultra-high-definition imaging system called "Super Hi-Vision" [2] is applied to IP is described. Fig.…”

Section: Introductionmentioning

confidence: 99%

Three-dimensional television system based on integral photography

Mishina

2011

2011 Visual Communications and Image Processing (VCIP)

View full text Add to dashboard Cite

A 3D television system based on integral photography, which is a spatial imaging method, is described. In our experimental system, Super Hi-Vision, which has a horizontal resolution of 7680 pixels and a vertical resolution of 4320 pixels, is applied to integral photography. A lens array composed of 400 (H) × 259 (V) gradient-index lenses is used for capturing objects to avoid pseudoscopic images. The experimental setup can capture and display full-color, 3D moving images in real time. It was confirmed that the appearance of a 3D image reconstructed by the system changed smoothly in accordance with the position of the observer within a viewing zone angle of 24 degrees.

show abstract

Section: Introductionmentioning

confidence: 99%

Three-dimensional television system based on integral photography

Mishina

2011

2011 Visual Communications and Image Processing (VCIP)

View full text Add to dashboard Cite

show abstract

“…The resolution and frame rate of recent image sensors have been improved to meet the increasing demand for high-reality video systems [1][2][3][4]. Conventional complementary metal-oxidesemiconductor (CMOS) image sensors have photodetectors and signal processors on the same plane, and they adopt columnparallel signal processing [5][6][7][8], where many pixels in each column operate to time-share a signal processor, as shown in Fig.…”

Section: Introductionmentioning

confidence: 99%

A novel MOSFET with vertical signal-transfer capability for 3D-structured CMOS image sensors

Goto

Hagiwara²,

Iguchi³

et al. 2014

IEEJ Trans Elec Electron Eng

View full text Add to dashboard Cite

We have developed a novel MOSFET that can transfer signals vertically without through‐silicon vias but by using a fully depleted silicon‐on‐insulator (FDSOI) structure with its source region connected to the back electrodes as well as the front ones. A prototype MOSFET fabricated using the backside anisotropic wet etching technique has confirmed that the electrical characteristics measured from the front and the back electrodes are identical. The subthreshold factor S of the prototype was found to be 64.5 mV/decade, suggesting a good switching performance. Since the double‐sided MOSFET has vertical signal‐transfer capability and excellent operating characteristics, it is expected to contribute to developing a More‐than‐Moore type device of three‐dimensional integration such as pixel‐parallel image sensors. © 2014 Institute of Electrical Engineers of Japan. Published by John Wiley & Sons, Inc.

show abstract

Integral Imaging

Arai

2013

Emerging Technologies for 3D Video

View full text Add to dashboard Cite

Experimental color video capturing equipment with three 33-megapixel CMOS image sensors

Cited by 10 publications

References 0 publications

Three-dimensional television system based on integral photography

Three-dimensional television system based on integral photography

A novel MOSFET with vertical signal-transfer capability for 3D-structured CMOS image sensors

Integral Imaging

Contact Info

Product

Resources

About