Experimental Characterization of a Chip-Level 3-D Printed Microjet Liquid Impingement Cooler for High-Performance Systems

Wei, Tiwei; Oprins, Herman; Cherman, Vladimir; Yang, Shoufeng; Wolf, Ingrid De; Beyne, Eric; Baelmans, Martine

doi:10.1109/tcpmt.2019.2905610

Cited by 15 publications

(11 citation statements)

References 23 publications

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“…This article shows additively manufactured polymer jet coolers and their integration with PCB-mounted power electronic devices provide research contributions beyond the state of the art. To our knowledge, only a few articles [16], [17] have reported miniature polymer nozzles for jet impingement cooling, and these articles report liquid cooling rather than this present study of air cooling. While most published research on jet cooling systems focuses on devices fabricated from metal [5], [7], [8], [13], [34]- [36], a polymer system of the same geometry is about 3× lighter than a metal system due to the lower density of polymer compared to metal [37].…”

Section: Resultsmentioning

confidence: 86%

“…For more information, see https://creativecommons.org/licenses/by/4.0/ welding technique was used to construct a water channel heat exchanger by joining thin (∼150 μm) sheets of polyethylene [15]. Recently, a liquid impingement cooler combining submillimeter-size (diameters of 575 μm) nozzle arrays, plenum layers, and impingement cavities was monolithically fabricated by stereolithography [16], [17]. Metal AM has also received attention for creating lightweight and efficient heat transfer systems, as monolithic fabrication of complex structures has the potential to reduce weight and interface thermal resistance [18]- [20].…”

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confidence: 99%

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Air Jet Impingement Cooling of Electronic Devices Using Additively Manufactured Nozzles

Kwon

Foulkes

Yang

et al. 2020

IEEE Trans. Compon., Packag. Manufact. Technol.

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This article reports the design, fabrication, and demonstration of additively manufactured air jet impingement coolers for the thermal management of high-power gallium nitride (GaN) transistors. The polymer jet coolers impinge high-speed airflow with a velocity of 42-195 m/s (Reynolds number between 1.87×10 4 and 8.77×10 4 ) onto working GaN devices mounted on a printed circuit board (PCB). The air jet provides cooling heat fluxes of up to 58.4 W/cm 2 , cooling rates of up to 6.6 • C/s, and convective heat transfer coefficient ranging from 5.2 to 17.0 kW/(m 2 •K). The cooling performance is comparable to that of jet coolers made from other materials and manufacturing technologies. A key benefit of additive manufacturing (AM) is design freedom and geometric complexity, which we highlight by demonstrating three different packaging configurations, each enabled by a different jet cooler design that is customized for different types of packaging configurations: Cooler 1 directs two parallel impinging jets onto the top side of two devices; cooler 2 directs two air jets onto the front side and two air jets onto the back side of two devices; and cooler 3 directs air jets onto the front side of four devices mounted on parallel adjacent circuit boards. The second benefit of AM is the ability to consolidate multiple components into a single part, which we highlight by combining a nozzle, a fluidic delivery system, and a flow distributor within a volume of 80 mm × 80 mm × 100 mm. This work demonstrates the potential of AM to create complex, lightweight, fluidic delivery systems to achieve thermally and hydrodynamically optimized air jet cooling for high-powerdensity electronic devices. Index Terms-Additive manufacturing (AM), convection heat transfer, electronic cooling, jet impingement. I. INTRODUCTIONJ ET impingement cooling has traditionally been used in gas turbine engines and metal quenching processes where rapid removal of heat is necessary. A high rate of fluid flow,

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Section: Resultsmentioning

confidence: 86%

mentioning

confidence: 99%

Air Jet Impingement Cooling of Electronic Devices Using Additively Manufactured Nozzles

Kwon

Foulkes

Yang

et al. 2020

IEEE Trans. Compon., Packag. Manufact. Technol.

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“…The modeling studies are performed in ANSYS Fluent. For both the full model and unit cell model, the Semi Implicit Method for Pressure Linked Equations (SIMPLE) [12,34,35] algorithm is used as the solution method. For the numerical scheme, the Quadratic Upstream Interpolation for Convective Kinematics (QUICK) scheme is chosen for the discretization.…”

Section: Modeling Methodologymentioning

confidence: 99%

“…A systematical parameter sensitivity study of the cooler geometry was conducted in our previous research [33]. The 14 mm × 14 mm × 8.7 mm cooler is mounted on the 8 mm × 8 mm thermal test chip [34]. The diameter of the inlet and outlet tube is 2 mm.…”

Section: Miroject Cooling Test Casementioning

confidence: 99%

“…As a more cost-efficient alternative, polymer-based impingement jet coolers show a great potential since it is already proved that very small nozzle diameter values are not necessary due to the saturation of the thermal improvement for further scaling of the nozzle diameter [33]. In [2,33,34], low cost polymer impingement jet coolers were demonstrated by using mechanical micromachining and 3D printing technology with nozzle diameters in the range of 300 to 600 µm. The flow rate used in electronic cooling applications is typically in the range between 300 mL/min to 2 L/min [33], resulting in Reynolds numbers ranging between 300 and 2000 based on the jet nozzle diameter.…”

Section: Introductionmentioning

confidence: 99%

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Conjugate Heat Transfer and Fluid Flow Modeling for Liquid Microjet Impingement Cooling with Alternating Feeding and Draining Channels

Wei

Oprins

Cherman

et al. 2019

Fluids

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Liquid microjet impingement cooling has shown the potential to be the solution for heat removal from electronic devices such as very-large-scale integration (VLSI) chips. The post-impingement dynamics of the jet, specifically the interaction between the liquid fronts on the surface engendered by the jets is a critical criterion improving the heat transfer characteristics. While some seminally important experimental studies have investigated this attribute, the amount of accurate data and analysis is limited by the shortcomings of real-life experiments. In this article, numerical investigations into the fluid dynamics and heat transfer in microjet cooling systems are carried out. Specifically, this paper addresses the question regarding the necessary fidelity of the simulations. Different Reynolds-averaged Navier–Stokes (RANS) models are compared to the Large Eddy Simulations (LES) simulation and the potential fidelity of different eddy-viscosity-based closures is clearly shown. Recommendations are made regarding the RANS closures that should give the best performance. It is demonstrated that the transition Shear Stress Transport (SST) model and k - ω SST model both show excellent ability to predict the local or average Nu, and also local level pressure coefficient f with less than 5% difference in the range of 30 < Red < 4000, compared with the reference LES model. For the experimental measurements in the range of 130 < Red < 1400, the LES model, transition SST model and k - ω SST model all show less than 25% prediction error. Moreover, it is shown that the validity of the unit cell assumption for the temperature and flow distribution depends on the flow rate.

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Experimental and numerical investigation of direct liquid jet impinging cooling using 3D printed manifolds on lidded and lidless packages for 2.5D integrated systems

Wei

Oprins

Cherman

et al. 2020

Applied Thermal Engineering

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Experimental Characterization of a Chip-Level 3-D Printed Microjet Liquid Impingement Cooler for High-Performance Systems

Cited by 15 publications

References 23 publications

Air Jet Impingement Cooling of Electronic Devices Using Additively Manufactured Nozzles

Air Jet Impingement Cooling of Electronic Devices Using Additively Manufactured Nozzles

Conjugate Heat Transfer and Fluid Flow Modeling for Liquid Microjet Impingement Cooling with Alternating Feeding and Draining Channels

Experimental and numerical investigation of direct liquid jet impinging cooling using 3D printed manifolds on lidded and lidless packages for 2.5D integrated systems

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