Experimental Assessment of Vapour Chamber Heater Spreader Implementation in Avionic Cooling

Jones, Andy; Chen, Rui; Murray, Angus

doi:10.2514/6.2015-0712

Cited by 6 publications

(3 citation statements)

References 13 publications

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“…The vapor chamber was found to be much more efficient than an equivalent metallic heat sink that occupied the same volume. For a component surface temperature ranging from 80 to 100 • C, the maximum dissipated power varied between 95 and 145 W. Similarly, Jones et al [128] embedded the vapor chamber within the avionics module chassis to reduce the thermal resistance between the avionics components and the module heat exchanger. The isothermalization of the avionics baseplate was significantly improved.…”

Section: Flat Heat Pipementioning

confidence: 99%

Thermal Management Technologies Used for High Heat Flux Automobiles and Aircraft: A Review

Zhang

Wang

et al. 2022

Energies

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In recent years, global automotive industries are going through a significant revolution from traditional internal combustion engine vehicles (ICEVs) to electric vehicles (EVs) for CO2 emission reduction. Very similarly, the aviation industry is developing towards more electric aircraft (MEA) in response to the reduction in global CO2 emission. To promote this technology revolution and performance advancement, plenty of electronic devices with high heat flux are implemented on board automobiles and aircraft. To cope with the thermal challenges of electronics, in addition to developing wide bandgap (WBG) semiconductors with satisfactory electric and thermal performance, providing proper thermal management solutions may be a much more cost-effective way at present. This paper provides an overview of the thermal management technologies for electronics used in automobiles and aircraft. Meanwhile, the active methods include forced air cooling, indirect contact cold plate cooling, direct contact baseplate cooling, jet impingement, spray cooling, and so on. The passive methods include the use of various heat pipes and PCMs. The features, thermal performance, and development tendency of these active and passive thermal management technologies are reviewed in detail. Moreover, the environmental influences introduced by vibrations, shock, acceleration, and so on, on the thermal performance and reliability of the TMS are specially emphasized and discussed in detail, which are usually neglected in normal operating conditions. Eventually, the possible future directions are discussed, aiming to serve as a reference guide for engineers and promote the advancement of the next-generation electronics TMS in automobile and aircraft applications.

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Section: Flat Heat Pipementioning

confidence: 99%

Thermal Management Technologies Used for High Heat Flux Automobiles and Aircraft: A Review

Zhang

Wang

et al. 2022

Energies

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“…Research of Filippo Pagnoni et al, 2021 found out that when exposed to a cold environment, the sintered titanium wick showed excellent mechanical resistance to repeated cycles of water freeze/thaw. For thermal management of electronics, various types of heat pipes have been developed such as flat heat pipes (Wang et al, 2023), pulsating heat pipes (Cai et al, 2015;Alhuyi Nazari et al, 2018) and vapor chamber (Jones and Chen, 2015). For heat dissipation applications, water is one of the most commonly used working fluid due to its high heat transfer coefficient, chemical stability and low cost.…”

Section: Introductionmentioning

confidence: 99%

Research on the thermal performance of the condenser in a loop heat pipe anti-icing system

Zhao,

Li,

Dang

et al. 2023

Front. Energy Res.

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Loop Heat Pipes (LHPs) are efficient heat transfer devices, providing a highly efficient and energy-saving thermal control integrated management method for Unmanned Aerial Vehicles (UAVs) with their flexible structural design. In this paper, a conceptual design of LHP anti-icing system was proposed, using LHP to transfer waste heat to wing’s leading edge. The outer surface temperature of wing skin is one of the main indicators to measure the anti-icing effect. As a result, this paper mainly focused on the heat transfer process of the condenser section by experimental and numerical simulation methods. A stainless steel-nickel LHP was fabricated and tested at different conditions. Volume of Fluid (VOF) method and Lee model were adopted to simulate the condensation process. Results showed that increasing the heating power (from 35 W to 60 W) slowed down the condensation and lengthened the two-phase zone. However, when the angle of attack changes within the range of 0°–10°, the liquid-vapor distribution in the tube remains almost unchanged. The average error of surface temperature between experiment and simulation results is 3.6% and 2.5% for the heating power of 180 W and 60 W respectively. Additionally, because the volume of water droplets collected is the largest at the leading edge of the wing, we recommend arranging the LHP condenser tube inlet near the leading edge of the wing and increasing the density of pipe arrangement to achieve better anti-icing effect.

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“…In military aircraft, the failures due to thermal issues are difficult to diagnose and are considered under the no-fault found category, contributing to more than 85% of all the identified operational failures in the avionic industry. 19,20 Hence, to tackle the heat dissipation problems in high heat flux devices particularly in the microelectronic and defence sector, a high heat dissipation cooling system like two-phase cooling systems is required instead of conventional metal heat spreaders. [21][22][23] Also, conventional air cooling techniques such as fans and blowers can handle heat fluxes up to 4 W/cm 2 , which is not adequate to cope with the increasing demands for the effective removal of heat from the electronic device.…”

Section: Introductionmentioning

confidence: 99%

Deployment of vapour chambers for electronic heat dissipation: state-of-the-art

Chitnis

Dayal

Arora

2022

Proceedings of the Institution of Mechanical Engineers, Part C:

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Miniaturization and high performance are the two principal requirements of modern electronics. All commercial applications demand reliable performance at high operational efficiency for prolonged service life. In order to meet all these requirements, the cooling system should be able to handle large heat fluxes packed in compact spaces and take away the heat as soon as possible to avoid overheating of the chip. Phase change heat transfer devices can handle large heat fluxes on account of latent heating. Lately, vapour chambers (VCs) are found to be promising heat spreaders as they are passive two-phase heat transfer devices. They effectively eliminate the hotspots, transferring high heat fluxes with better efficiencies and offer lower thermal resistance compared to the conventional cooling techniques. A detailed review of the latest research and advancements in the field of VCs is presented in this paper, including the effect of different thermo-physical parameters on their performance. Finally, all the major findings are summarized, including the future scope of development in a systematic manner.

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Experimental Assessment of Vapour Chamber Heater Spreader Implementation in Avionic Cooling

Cited by 6 publications

References 13 publications

Thermal Management Technologies Used for High Heat Flux Automobiles and Aircraft: A Review

Thermal Management Technologies Used for High Heat Flux Automobiles and Aircraft: A Review

Research on the thermal performance of the condenser in a loop heat pipe anti-icing system

Deployment of vapour chambers for electronic heat dissipation: state-of-the-art

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