“…However, with increasing complexity in terms of geometry [3], [4], materials [5], [6], and surface finishing, achieving accurate multipactor simulations becomes a challenge. Modeling tools have seen large advances recently [7]- [9], and simulations with modulated signal [10], [11], space charge [12], multiple materials [13], [14], or simple noise characterization [15] are common nowadays. All of these advances in the simulation field are driving designers to request that their devices are tested against the same conditions that they were simulated-in terms of RF power, signal modulation, and temperature [16].…”