Experimental analysis of ductile-brittle transitions for parallel and intersecting micro-slot grinding in BK-7 glass

Pratap, Ashwani; Patra, Karali; D’yakonov, A. A.

doi:10.1016/j.ceramint.2019.02.185

Cited by 24 publications

(3 citation statements)

References 29 publications

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“…Kumar et al [ 14 ], Zhang et al [ 15 ] proposed that laser irradiations should be carried out before processing silicon nitride ceramics to induce cracks and microcracks on the surface, reduce the strength of the material and improve the machinability. Pratap et al [ 16 ] investigated the material removal mechanism and analyzed the damage occurrence for parallel as well as intersecting micro grinding. Rao et al [ 17 ] revealed that adhesion and pullout of diamond grits in laser-assisted grinding were remarkable difference from those in conventional grinding due to the thermal softening of both RB-SiC specimen and bond material of the grinding wheel.…”

Section: Introductionmentioning

confidence: 99%

Experimental Investigation of Grinding Force and Material Removal Mechanism of Laser-Structured Zirconia Ceramics

Pang

Yan

et al. 2022

Micromachines

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Zirconia is a high demanded structural ceramic with desirable mechanical, thermal, and chemical properties. Poor surface integrity and limited material removal rate caused by high cutting force and wheel wear are the main problems in ceramic grinding. In order to reduce the grinding force and enhance the removal rate in grinding, zirconia ceramics are firstly ablated by laser and then be grinded. A nanosecond laser is used to ablate the surface of zirconia ceramic, the laser-ablated structures with micro pits and thermal microcracks are generated. With the input of subsequent grinding, the machinability of zirconia ceramic workpiece with laser-ablated structures changes. Grinding experiments are conducted to study the grinding force and the material remove of laser-structured zirconia ceramic. Results show that the grinding forces in tangential and normal direction are significantly reduced. Compared to the grinding surface without laser-structured, a damage-free grinding surface is obtained by laser assistance.

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Section: Introductionmentioning

confidence: 99%

Experimental Investigation of Grinding Force and Material Removal Mechanism of Laser-Structured Zirconia Ceramics

Pang

Yan

et al. 2022

Micromachines

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“…A smooth fused silica surface without any micro-cracks can be generated through the ductile mode grinding when the feed speed and the grinding depth are 10 µm and 1 mm/min, respectively [14]. During single/parallel micro-slot grinding of BK7 glass, two critical steps of undeformed chip thickness for the transition from ductile to ductilebrittle mode and for the transition from ductile-brittle to brittle mode are instituted to be 15.72 nm and 29.80 nm, respectively [15,16]. However, the ductile mode grinding parameters for some optical glasses are impossible to be used in the practical fabricating process for its extremely low material removal efficiency.…”

Section: Introductionmentioning

confidence: 99%

Mechanism analysis and modelling of surface roughness for CeO2 slurry assisted grinding of BK7 optics considering both particle size and mass fraction

Zhang¹,

Yao

Li³

et al. 2022

Preprint

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Prolonged polishing deteriorates the shape accuracy of an optical element and reduces production efficiency simultaneously. In order to reduce the amount of polishing and polishing time, even obtain polish-free fine surfaces, a cerium oxide (CeO2) slurry assisted grinding (SAG) is investigated. A novel theoretical model was established to predict the surface roughness of the workpiece processed by CeO2 SAG. The modelling considered the effects of the protrusion height of active grains in the grinding wheel and the sizes and mass fractions of CeO2 particles in the grinding zone on undeformed chip thickness (UCT). Then, the mechanism of CeO2 SAG was investigated through nanoindentation method. Indentation hardness and energy spectrum of the surface were estimated to verify the softened layer. The results showed that the model of surface roughness was well consistent with the experiment. The CeO2 particle size significantly influenced on the surface roughness than the mass fraction. The load-bearing effect of larger CeO2 particle size reduced the protruding height of the grinding wheel grains and reduced the UCT to a greater extent in grinding process. The chemical reaction between CeO2 slurry and BK7 glass results in a softening layer which enhances the critical load and critical depth of ductile-brittle transition of grinding. Finally, the optimized parameters were used for CeO2 SAG of an ellipsoid BK7 optics.

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“…When used for optical components (such as reflection mirrors), these require a high-quality processed surface. In general, the machined surface quality of advanced ceramics is directly affected by the material removal mechanisms during the grinding process [10,11]. In 1991, Bifano [12] proposed a ductile-regime grinding method for the processing of brittle materials and concluded that if the dimensional scale of material removal was sufficiently small, material removal would proceed by a mechanism of plastic flow rather than fracture.…”

Section: Introductionmentioning

confidence: 99%

Experimental studies on material removal mechanisms in ultrasonic assisted grinding of SiC ceramics with a defined grain distribution brazed grinding wheel

Ding

Zhang

2021

Int J Adv Manuf Technol

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Ultrasonic assisted grinding (UAG) is one of the most suitable methods for the processing of hard and brittle materials such as silicon carbide (SiC). During UAG of SiC, the machining quality is directly determined by the material removal mechanism. However, the research on the material removal mechanism for UAG of SiC is still not sufficiently developed. To achieve better comprehension of the material removal mechanism in UAG of SiC, this study conducted both UAG and conventional grinding (CG) tests with a brazed grinding wheel with defined grain distribution. The material removal mechanism in UAG of SiC was studied by comparing the ground surface/subsurface micro-morphology, surface roughness, grinding force, and specific grinding energy between both processes. The results showed that the material removal mechanism experienced a transition from ductile removal to brittle fracture with increasing undeformed chip thickness in both UAG and CG. In addition, the ground surface roughness, grinding force, and subsurface breakage size increased with increasing undeformed chip thickness, while the specific grinding energy first decreased rapidly and then stabilised. Compared with conventional grinding, UAG always resulted in lower surface/subsurface breakage, surface roughness grinding force, and specific grinding energy under identical operating conditions.

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Experimental analysis of ductile-brittle transitions for parallel and intersecting micro-slot grinding in BK-7 glass

Cited by 24 publications

References 29 publications

Experimental Investigation of Grinding Force and Material Removal Mechanism of Laser-Structured Zirconia Ceramics

Experimental Investigation of Grinding Force and Material Removal Mechanism of Laser-Structured Zirconia Ceramics

Mechanism analysis and modelling of surface roughness for CeO2 slurry assisted grinding of BK7 optics considering both particle size and mass fraction

Experimental studies on material removal mechanisms in ultrasonic assisted grinding of SiC ceramics with a defined grain distribution brazed grinding wheel

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