Excimer laser micro machining: fabrication and applications of dielectric masks

Ihlemann, J.; Rubahn, K.

doi:10.1016/s0169-4332(99)00464-x

Cited by 34 publications

(19 citation statements)

References 9 publications

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“…For the patterning of UV-absorbing coatings, ablation in a rear side configuration (the laser light is transmitted through the transparent substrate to the coating layer) has been proven to lead to well defined edges and minimized debris formation [14]. Rear side ablation at a laser wavelength of 193 nm (ArF-excimer laser) was applied here in a mask projection set up.…”

Section: Nanosecond Laser Rear Side Ablation Of Sio Xmentioning

confidence: 99%

“…For the fabrication of high resolution (sub-µm-) patterns the rear side ablation does not seem practicable, because the steepness of the side walls decreases for narrow ablation grooves [14]. On the other hand, front side ablation of such coatings using nanosecond lasers, leads to insufficient quality due to the formation of melt rims [15].…”

Section: Uv-femtosecond Laser Ablation Of Sio Xmentioning

confidence: 99%

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Fabrication of SiO2 Phase Gratings by UV Laser Patterning of Silicon Suboxide Layers and Subsequent Oxidation

Bekesi¹,

Simon²,

Ihlemann

2006

JLMN

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UV transparent phase masks are used in various laser applications like fabrication of Bragg gratings in optical fibers or micro patterning by high power laser ablation. Normally they are fabricated by a costly lithographic process including e-beam writing and reactive ion etching. We propose a new fabrication method based on UV laser ablation. The process consists of three steps. First, a silicon suboxide coating (SiO x with x < 2) with a predefined thickness is deposited on a fused silica substrate. Second, due to its strong UV-absorption, this coating can be removed in defined areas by excimer laser ablation at 193 nm or 248 nm leading to the desired phase pattern in form of a binary depth profile. Third, by applying a thermal annealing process, the remaining SiO xcoating is oxidized to UV-transparent SiO 2 , resulting in a UV-grade surface relief element. The precisely defined interface between substrate and layer allows for ablation with exact depth control and perfect optical surface quality. Such SiO 2 phase masks feature a large processed area, high efficiency for VUV to NIR radiation and can be customized e.g. for perfect zero order suppression. Applications of such phase gratings for materials processing with a UV-femtosecond laser are demonstrated. Using the phase gratings in a mask projection configuration, submicron patterns are created in a variety of materials.

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Section: Nanosecond Laser Rear Side Ablation Of Sio Xmentioning

confidence: 99%

Section: Uv-femtosecond Laser Ablation Of Sio Xmentioning

confidence: 99%

Fabrication of SiO2 Phase Gratings by UV Laser Patterning of Silicon Suboxide Layers and Subsequent Oxidation

Bekesi¹,

Simon²,

Ihlemann

2006

JLMN

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“…Laser ablation and photo-etching of polymers have been studied extensively especially in the visible and deep ultraviolet (DUV) spectral range [1][2][3][4][5]. For these wavelengths, ablation can be described in terms of thermal, photo-thermal and photo-chemical models, or as a combination of these mechanisms [6].…”

Section: Introductionmentioning

confidence: 99%

Ablation of polymers by focused EUV radiation from a table-top laser-produced plasma source

2011

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We have investigated ablation of polymers with radiation of 13.5 nm wavelength, using a table-top laser produced plasma source based on solid gold as target material. A Schwarzschild objective with Mo/Si multilayer coatings was adapted to the source, generating an EUV spot of 5 µm diameter with a maximum energy density of ∼1.3 J/cm 2 . In combination with a Zirconium transmission filter, radiation of high spectral purity (2% bandwidth) can be provided on the irradiated spot. Ablation experiments were performed on PMMA, PTFE and PC. Ablation rates were determined for varying fluences using atomic force microscopy and white light interferometry. The slopes of these curves are discussed with respect to the chemical structure of the polymers. Additionally, the ablation behavior in terms of effective penetration depths, threshold fluences and incubation effects is compared to literature data for higher UV wavelength.

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“…It has actual and potential applications in micromechanics, metallurgy, integrated optics, electronics, optoelectronics, sensor technology and chemical engineering (Fourrier et al, 2001;Hashioka and Matsumura, 2000;Ihlemann and Rubahn, 2000;Zheng, 2006). Most of the current laser-induced manufacturing technologies, such as ultraviolet lithography, femtosecond laser processing and excimer laser fabrication (Bauer et al, 2000;Hector and Mangat, 2001;Korte et al, 2004;Lim et al, 2006;Solak et al, 1999), are based on the ablation or etching effects of substrate material caused by the high power density of the focused laser beam.…”

Section: Introductionmentioning

confidence: 99%

Micro‐fabrication and monitoring of three‐dimensional microstructures based on laser‐induced thermoplastic formation

Wang

Zhang

Wen

et al. 2009

Microscopy Res & Technique

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This article reports a novel laser-induced micro-fabrication method and its monitoring system for three-dimensional (3D) microstructures. The mechanism of the method is that a small zone of thermoplastic material melted by laser heating grows in liquid surrounding environment, solidifying into a convex microstructure, such as micro-dot or micro-pillar. A laser diode (808 nm) with maximum power output of 130 mW is used as power source, and a kind of paraffin mixed with stearic acid and paint serves as the thermoplastic material for 3D microstructure formation experiments. A light microscope system consisting of a charge-coupled device (CCD) and a computer is utilized to realize real-time observation of the micro-fabricating process. The distribution of local temperature rise on material surface created by laser irradiation is simulated. The effects of liquid environment on microstructure formation have been theoretically analyzed and experimentally studied. Experiments are further carried out to investigate the relationship between laser spot and fabricated microstructures. The results indicate that the widths of micro-dots or micro-pillars are mostly determined by the size of focal spot, and their heights increase with the enlargement of laser power density. With this method, a micro-dot array of Chinese characters meaning "China" has been successfully fabricated through computer programming. This method has the advantages of implementing direct, mask-less, real-time and inexpensive 3D microstructure fabrication. Therefore, it would be widely applied in the fields of micro/nano-technology for practical fabrication of different kinds of 3D microstructures.

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Excimer laser micro machining: fabrication and applications of dielectric masks

Cited by 34 publications

References 9 publications

Fabrication of SiO2 Phase Gratings by UV Laser Patterning of Silicon Suboxide Layers and Subsequent Oxidation

Fabrication of SiO2 Phase Gratings by UV Laser Patterning of Silicon Suboxide Layers and Subsequent Oxidation

Ablation of polymers by focused EUV radiation from a table-top laser-produced plasma source

Micro‐fabrication and monitoring of three‐dimensional microstructures based on laser‐induced thermoplastic formation

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